Lin Qi, Weiling Xu, Ben Fan, Xingyu Pan, Xingke Zhang, Peipei Yu, Yafei Zhao, Xinchao Tan, Xiaomei Tian, Hailong Li
{"title":"7K极低温贮藏对SAC305/SnPb混合焊点电学和力学性能影响的研究","authors":"Lin Qi, Weiling Xu, Ben Fan, Xingyu Pan, Xingke Zhang, Peipei Yu, Yafei Zhao, Xinchao Tan, Xiaomei Tian, Hailong Li","doi":"10.1007/s10854-025-14301-4","DOIUrl":null,"url":null,"abstract":"<div><p>The effect of 7K extreme low temperature storage on the electrical and mechanical properties of Sn–3.0%Ag–0.5%Cu(SAC305)/SnPb/electroless nickel immersion gold (ENIG) pads mixed solder joints was investigated. The resistance of the daisy chained solder joints was measured after RT and 7K storage, respectively. Ball shear test was conducted, and the morphography of the fracture surfaces was analyzed. Microstructure observations revealed that the composition of the intermetallic compound (IMC) layer next to the printed circuit boards (PCB) pads remained a combination of (Cu, Ni)<sub>6</sub>Sn<sub>5</sub> and (Ni, Cu)<sub>3</sub>Sn<sub>4</sub> after 7K storage. A very small amount of residual Pb rich phase owing to the degolding and plating process, even 1 wt%, could inhibit the evolution of IMCs as well as tin pest. This study could provide theoretical support for the application of SAC305/SnPb mixed solder joints under extreme low temperature, such as thermally uncontrolled electronics for deep space exploration.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 4","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Research on the effect of 7K extreme low temperature storage on the electrical and mechanical properties of SAC305/SnPb mixed solder joints\",\"authors\":\"Lin Qi, Weiling Xu, Ben Fan, Xingyu Pan, Xingke Zhang, Peipei Yu, Yafei Zhao, Xinchao Tan, Xiaomei Tian, Hailong Li\",\"doi\":\"10.1007/s10854-025-14301-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The effect of 7K extreme low temperature storage on the electrical and mechanical properties of Sn–3.0%Ag–0.5%Cu(SAC305)/SnPb/electroless nickel immersion gold (ENIG) pads mixed solder joints was investigated. The resistance of the daisy chained solder joints was measured after RT and 7K storage, respectively. Ball shear test was conducted, and the morphography of the fracture surfaces was analyzed. Microstructure observations revealed that the composition of the intermetallic compound (IMC) layer next to the printed circuit boards (PCB) pads remained a combination of (Cu, Ni)<sub>6</sub>Sn<sub>5</sub> and (Ni, Cu)<sub>3</sub>Sn<sub>4</sub> after 7K storage. A very small amount of residual Pb rich phase owing to the degolding and plating process, even 1 wt%, could inhibit the evolution of IMCs as well as tin pest. This study could provide theoretical support for the application of SAC305/SnPb mixed solder joints under extreme low temperature, such as thermally uncontrolled electronics for deep space exploration.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"36 4\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2025-02-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-025-14301-4\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14301-4","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Research on the effect of 7K extreme low temperature storage on the electrical and mechanical properties of SAC305/SnPb mixed solder joints
The effect of 7K extreme low temperature storage on the electrical and mechanical properties of Sn–3.0%Ag–0.5%Cu(SAC305)/SnPb/electroless nickel immersion gold (ENIG) pads mixed solder joints was investigated. The resistance of the daisy chained solder joints was measured after RT and 7K storage, respectively. Ball shear test was conducted, and the morphography of the fracture surfaces was analyzed. Microstructure observations revealed that the composition of the intermetallic compound (IMC) layer next to the printed circuit boards (PCB) pads remained a combination of (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 after 7K storage. A very small amount of residual Pb rich phase owing to the degolding and plating process, even 1 wt%, could inhibit the evolution of IMCs as well as tin pest. This study could provide theoretical support for the application of SAC305/SnPb mixed solder joints under extreme low temperature, such as thermally uncontrolled electronics for deep space exploration.
期刊介绍：
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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