柔性硅:现状、机遇和挑战

Nikitha Kannan;Navneet Gupta
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引用次数: 0

摘要

万物互联的兴起刺激了对柔性和可伸缩电子设备的需求,特别是在生物医学应用中。单晶硅,半导体工业的关键材料,必须适应这些需求。本文探讨了制造柔性硅片的各种减薄技术,将硅转移到柔性衬底的方法,以及提高硅的可拉伸性的重要性。此外,它还讨论了柔性硅对生物医学传感、电子和电力系统等领域的影响,强调了物联网(IoT)平台在互连设备中的作用。最后,本文探讨了柔性硅技术的当前进展和未来前景,为这个快速发展的领域的进一步发展铺平了道路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Flexible Silicon: Status, Opportunities, and Challenges
The rise of the Internet of Everything has spurred the need for flexible and stretchable electronic devices, particularly in biomedical applications. Monocrystalline silicon, a key material in the semiconductor industry, must be adapted to meet these demands. This article explores various thinning techniques to fabricate flexible silicon wafers, methods for transferring silicon to flexible substrates, and the importance of enhancing silicon’s stretchability. Furthermore, it discusses the impact of flexible silicon on sectors such as biomedical sensing, electronics, and power systems, highlighting the role of the Internet of Things (IoT) platform in interconnecting devices. Finally, this article examines current progress and future prospects in flexible silicon technology, paving the way for further advancements in this rapidly evolving field.
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