微机电系统装配用热解聚系绳

IF 2.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Microelectromechanical Systems Pub Date : 2024-12-13 DOI:10.1109/JMEMS.2024.3511476

Oluwatoyin Atikekeresola;C. K. Harnett

{"title":"微机电系统装配用热解聚系绳","authors":"Oluwatoyin Atikekeresola;C. K. Harnett","doi":"10.1109/JMEMS.2024.3511476","DOIUrl":null,"url":null,"abstract":"Microelectromechanical systems (MEMS) assembly into packages that interface with the environment is critical in electronic sensor applications ranging from soft biomedical systems to telecommunications. This article presents a novel process using heat-depolymerizable polyethylene carbonate (QPAC-25) as a sacrificial tether, and demonstrates it for assembling wafer-bound MEMS onto wires. The assembly mechanism is thermal removal of the tether, allowing a strained layer to pop up from the substrate and make electrical and mechanical contact with the wire. We detail the QPAC-25 fabrication procedures, characterize the relationship between QPAC-25 thickness and spin speed and determine a route to pattern QPAC-25 without a metal hard mask or photosensitizers.[2024-0157]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"1-3"},"PeriodicalIF":2.5000,"publicationDate":"2024-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Heat-Depolymerizable Tethers for Microelectromechanical System Assembly\",\"authors\":\"Oluwatoyin Atikekeresola;C. K. Harnett\",\"doi\":\"10.1109/JMEMS.2024.3511476\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Microelectromechanical systems (MEMS) assembly into packages that interface with the environment is critical in electronic sensor applications ranging from soft biomedical systems to telecommunications. This article presents a novel process using heat-depolymerizable polyethylene carbonate (QPAC-25) as a sacrificial tether, and demonstrates it for assembling wafer-bound MEMS onto wires. The assembly mechanism is thermal removal of the tether, allowing a strained layer to pop up from the substrate and make electrical and mechanical contact with the wire. We detail the QPAC-25 fabrication procedures, characterize the relationship between QPAC-25 thickness and spin speed and determine a route to pattern QPAC-25 without a metal hard mask or photosensitizers.[2024-0157]\",\"PeriodicalId\":16621,\"journal\":{\"name\":\"Journal of Microelectromechanical Systems\",\"volume\":\"34 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2024-12-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Microelectromechanical Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10801214/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectromechanical Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10801214/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

摘要

微机电系统（MEMS）组装成与环境接口的封装在从软生物医学系统到电信的电子传感器应用中至关重要。本文介绍了一种使用热解聚聚乙烯碳酸酯（QPAC-25）作为牺牲系绳的新工艺，并演示了它用于将晶圆束缚的MEMS组装到电线上。装配机制是热移除系绳，允许一个应变层从基板弹出，并与电线进行电气和机械接触。我们详细介绍了QPAC-25的制造过程，表征了QPAC-25厚度和旋转速度之间的关系，并确定了不使用金属硬掩膜或光敏剂的QPAC-25图案的路线。[2024-0157]

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Heat-Depolymerizable Tethers for Microelectromechanical System Assembly

Microelectromechanical systems (MEMS) assembly into packages that interface with the environment is critical in electronic sensor applications ranging from soft biomedical systems to telecommunications. This article presents a novel process using heat-depolymerizable polyethylene carbonate (QPAC-25) as a sacrificial tether, and demonstrates it for assembling wafer-bound MEMS onto wires. The assembly mechanism is thermal removal of the tether, allowing a strained layer to pop up from the substrate and make electrical and mechanical contact with the wire. We detail the QPAC-25 fabrication procedures, characterize the relationship between QPAC-25 thickness and spin speed and determine a route to pattern QPAC-25 without a metal hard mask or photosensitizers.[2024-0157]

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Journal of Microelectromechanical Systems 工程技术-工程：电子与电气

CiteScore

6.20

自引率

7.40%

发文量

115

审稿时长

7.5 months

期刊介绍： The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.