二维范德华半导体的接触工程

Jiachen Tang, Shuaixing Li, Li Zhan, Songlin Li
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引用次数: 0

摘要

二维(2D)半导体代表了最有前途的后硅通道材料的最终电子。然而,独特的原子厚度使其无法通过离子注入和热活化与传统的原子掺杂技术相兼容,这对构建与二维半导体的欧姆接触构成了关键挑战。在过去十年中,一直致力于解决这一重大挑战。本文通过分析电极与二维半导体接触电阻的来源,回顾了二维范德华半导体接触工程的各种策略以及在这一特定问题上取得的稳步进展,以期为下一代电子器件的二维半导体器件设计和集成提供指导。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Contact engineering for two-dimensional van der Waals semiconductors

Contact engineering for two-dimensional van der Waals semiconductors
Two-dimensional (2D) semiconductors represent the most promising post-silicon channel materials for ultimate electronics. However, the unique atomic thickness renders them incompatible with traditional atomic doping technique through ion implantation and thermal activation, which poses a key challenge for constructing ohmic contacts with 2D semiconductors. In the last decade, constant efforts have been devoted to address this critical challenge. In this article, by casting light on the origins of contact resistance between electrodes and 2D semiconductors, we review various strategies of contact engineering for 2D van der Waals semiconductors and the steady progress achieved in this specific issue, in order to provide guidance for device design and integration of 2D semiconductors for next-generation electronics.
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