电弧直接能量沉积HEAs颗粒增强AlMgSc合金的冶金界面及晶粒细化效果研究

IF 4.2 Q2 ENGINEERING, MANUFACTURING

Additive manufacturing letters Pub Date : 2025-01-20 DOI:10.1016/j.addlet.2025.100271

Shihao Shi, Yingying Ren, Shihao Kang, Yongqin Liu, Chenyu Liu, Yaning He, Yinghui Zhou

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引用次数: 0

摘要

在电弧定向能沉积法（Arc - ded）制备AlMgSc合金的基础上，采用一层一层同轴沉积粉末和线材的方法制备了HEAs高熵合金增强AlMgSc合金。HEAs粉末与α-Al基体表现出良好的冶金结合，颗粒中的Co、Fe、Ni等元素在界面处明显向基体扩散。HEAs粉末的加入显著改善了显微组织。AlMgSc合金的平均晶粒尺寸为40.7±13.9 μm， AlMgSc- heas合金的平均晶粒尺寸为14.5±4.9 μm，晶粒尺寸减小了64%。与AlMgSc合金相比，AlMgSc- heas合金的屈服强度提高了9%。

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Study on metallurgical interface and grain refinement effect in AlMgSc alloy reinforced with HEAs particles formed by arc-direct energy deposition

On the basis of the AlMgSc alloy formed by Arc-DED (Arc Directed Energy Deposition), we adopted a method of coaxially depositing powder and wire layer by layer to fabricate the AlMgSc alloy enhanced by (HEAs) High Entropy Alloys. The HEAs powder exhibited favorable metallurgical bonding with the α-Al matrix, and the elements such as Co, Fe, and Ni in the HEAs particles obviously diffused towards the matrix at the interface. The addition of HEAs powder significantly refined the microstructure. The average grain size of the AlMgSc alloy was 40.7 ± 13.9 μm, while that of the AlMgSc-HEAs alloy was 14.5 ± 4.9 μm, with a 64 % reduction in grain size. Compared with the AlMgSc alloy, the yield strength (YS) of the AlMgSc-HEAs alloy was increased by 9 %.

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来源期刊

Additive manufacturing letters Materials Science (General), Industrial and Manufacturing Engineering, Mechanics of Materials

CiteScore

3.70

自引率

0.00%

发文量

审稿时长

37 days