{"title":"改进DDR5存储器中信号完整性的连接器终端设计创新","authors":"Yuchen Lee;Shuhao Liang","doi":"10.1109/TEMC.2025.3526370","DOIUrl":null,"url":null,"abstract":"This article introduces an innovative connector terminal design for double data rate fifth-generation synchronous dynamic random-access memory (DDR5) connectors to enhance signal integrity in high-frequency memory systems. With the evolution of memory technology from DDR1 to DDR5, the requirements for higher transmission speeds and less signal distortion have necessitated more precise terminal designs. Simulations were conducted using ANSYS high-frequency structure simulator to assess the proposed stub design's high-frequency performance in terms of impedance, insertion loss (IL), return loss, and crosstalk (XT). Experimental results confirmed the superiority of the proposed design, which eliminates the 2.16 mm terminal stub from the conventional design. This modification minimized impedance variation, reduced IL by 0.2–0.4 dB in the 9–14.5 GHz frequency range, and enabled higher resonant frequencies in XT tests, thus enhancing signal integrity. These improvements hold significant promise for high-frequency applications, establishing a new design paradigm for DDR5 connector gold fingers and providing valuable insights for future high-speed memory interfaces.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 2","pages":"609-618"},"PeriodicalIF":2.0000,"publicationDate":"2025-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Innovations in Connector Terminal Design for Improved Signal Integrity in DDR5 Memory\",\"authors\":\"Yuchen Lee;Shuhao Liang\",\"doi\":\"10.1109/TEMC.2025.3526370\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article introduces an innovative connector terminal design for double data rate fifth-generation synchronous dynamic random-access memory (DDR5) connectors to enhance signal integrity in high-frequency memory systems. With the evolution of memory technology from DDR1 to DDR5, the requirements for higher transmission speeds and less signal distortion have necessitated more precise terminal designs. Simulations were conducted using ANSYS high-frequency structure simulator to assess the proposed stub design's high-frequency performance in terms of impedance, insertion loss (IL), return loss, and crosstalk (XT). Experimental results confirmed the superiority of the proposed design, which eliminates the 2.16 mm terminal stub from the conventional design. This modification minimized impedance variation, reduced IL by 0.2–0.4 dB in the 9–14.5 GHz frequency range, and enabled higher resonant frequencies in XT tests, thus enhancing signal integrity. These improvements hold significant promise for high-frequency applications, establishing a new design paradigm for DDR5 connector gold fingers and providing valuable insights for future high-speed memory interfaces.\",\"PeriodicalId\":55012,\"journal\":{\"name\":\"IEEE Transactions on Electromagnetic Compatibility\",\"volume\":\"67 2\",\"pages\":\"609-618\"},\"PeriodicalIF\":2.0000,\"publicationDate\":\"2025-01-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electromagnetic Compatibility\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10856684/\",\"RegionNum\":3,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10856684/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Innovations in Connector Terminal Design for Improved Signal Integrity in DDR5 Memory
This article introduces an innovative connector terminal design for double data rate fifth-generation synchronous dynamic random-access memory (DDR5) connectors to enhance signal integrity in high-frequency memory systems. With the evolution of memory technology from DDR1 to DDR5, the requirements for higher transmission speeds and less signal distortion have necessitated more precise terminal designs. Simulations were conducted using ANSYS high-frequency structure simulator to assess the proposed stub design's high-frequency performance in terms of impedance, insertion loss (IL), return loss, and crosstalk (XT). Experimental results confirmed the superiority of the proposed design, which eliminates the 2.16 mm terminal stub from the conventional design. This modification minimized impedance variation, reduced IL by 0.2–0.4 dB in the 9–14.5 GHz frequency range, and enabled higher resonant frequencies in XT tests, thus enhancing signal integrity. These improvements hold significant promise for high-frequency applications, establishing a new design paradigm for DDR5 connector gold fingers and providing valuable insights for future high-speed memory interfaces.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.