{"title":"走向与晶圆片兼容的二维电子学","authors":"Jianfeng Jiang, Peng Wu, Yifan Liu, Jing Kong, Lian-Mao Peng","doi":"10.1038/s44287-024-00125-7","DOIUrl":null,"url":null,"abstract":"2D semiconductors, one of the transformative technologies for sub-1-nm technology node integrated circuits, are at a tipping point in transitioning from laboratory research to industry manufacturing. Therefore, 2D transistor fabrication and chip integration that are compatible with standard foundry workflows and benchmarks that meet industry requirements must be established.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 1","pages":"6-8"},"PeriodicalIF":0.0000,"publicationDate":"2025-01-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Towards fab-compatible two-dimensional electronics\",\"authors\":\"Jianfeng Jiang, Peng Wu, Yifan Liu, Jing Kong, Lian-Mao Peng\",\"doi\":\"10.1038/s44287-024-00125-7\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"2D semiconductors, one of the transformative technologies for sub-1-nm technology node integrated circuits, are at a tipping point in transitioning from laboratory research to industry manufacturing. Therefore, 2D transistor fabrication and chip integration that are compatible with standard foundry workflows and benchmarks that meet industry requirements must be established.\",\"PeriodicalId\":501701,\"journal\":{\"name\":\"Nature Reviews Electrical Engineering\",\"volume\":\"2 1\",\"pages\":\"6-8\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2025-01-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Nature Reviews Electrical Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.nature.com/articles/s44287-024-00125-7\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nature Reviews Electrical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.nature.com/articles/s44287-024-00125-7","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Towards fab-compatible two-dimensional electronics
2D semiconductors, one of the transformative technologies for sub-1-nm technology node integrated circuits, are at a tipping point in transitioning from laboratory research to industry manufacturing. Therefore, 2D transistor fabrication and chip integration that are compatible with standard foundry workflows and benchmarks that meet industry requirements must be established.
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