{"title":"欧洲先进封装和异质集成电子元件和系统（APECS）试点线","authors":"Patrick R. Bressler, Michael Töpper, Peter Ramm","doi":"10.1038/s44287-024-00134-6","DOIUrl":null,"url":null,"abstract":"The European Chips Act of 2022 calls for European microelectronics pilot lines to develop and validate novel design and fabrication technologies for next-generation microelectronic chips. Fundamental for new electronic components and systems, advanced packaging and heterogeneous integration technologies are the focus of the APECS pilot line.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 1","pages":"4-5"},"PeriodicalIF":0.0000,"publicationDate":"2025-01-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Europe’s pilot line for advanced packaging and heterogeneous integration of electronic components and systems (APECS)\",\"authors\":\"Patrick R. Bressler, Michael Töpper, Peter Ramm\",\"doi\":\"10.1038/s44287-024-00134-6\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The European Chips Act of 2022 calls for European microelectronics pilot lines to develop and validate novel design and fabrication technologies for next-generation microelectronic chips. Fundamental for new electronic components and systems, advanced packaging and heterogeneous integration technologies are the focus of the APECS pilot line.\",\"PeriodicalId\":501701,\"journal\":{\"name\":\"Nature Reviews Electrical Engineering\",\"volume\":\"2 1\",\"pages\":\"4-5\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2025-01-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Nature Reviews Electrical Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.nature.com/articles/s44287-024-00134-6\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nature Reviews Electrical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.nature.com/articles/s44287-024-00134-6","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Europe’s pilot line for advanced packaging and heterogeneous integration of electronic components and systems (APECS)
The European Chips Act of 2022 calls for European microelectronics pilot lines to develop and validate novel design and fabrication technologies for next-generation microelectronic chips. Fundamental for new electronic components and systems, advanced packaging and heterogeneous integration technologies are the focus of the APECS pilot line.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
