脉冲功率电容器用反铁电cd修饰(Pb, La) (Sn, Zr, Ti) O3陶瓷的相位调节设计策略

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Fengji Chen, Zhonghua Yao, Cong Su, Hua Hao, Minghe Cao, Hanxing Liu
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引用次数: 0

摘要

应用于脉冲场的片式电容器在高电场条件下能提供超常的放电能量,可用于大功率脉冲。但由于介质陶瓷的能量密度低,限制了总放电能量,因此需要发展多层结构设计。接下来的问题是开发低温烧结陶瓷,并与低成本的铜电极共烧制备多层陶瓷。本研究旨在通过相位调节降低掺镉(Pb, La)(Sn, Zr, Ti)O3 (PCLSZT)陶瓷的烧结温度并调整其反铁电性能。结果表明,Cd的修饰大大降低了烧结温度,而Ti的调节可以逐渐诱导正交-四方相变,从而优化介电能量的存储。在260 kV/cm低电场下,O3 (Pb0.955Cd0.015La0.02)(Sn0.5Zr0.45Ti0.05)具有良好的能量特性,电荷能量密度为3.52 J/cm3,能量效率为85%,放电速度为t0.9 = 0.74 μs。这表明AFE掺杂cd的PCLSZT陶瓷具有能量特性的可调性,从而为开发多层脉冲功率元件的新兴材料提供了潜在的替代方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Phase regulated design strategy of antiferroelectric Cd-modified (Pb, La) (Sn, Zr, Ti) O3 ceramics for pulsed power capacitors

Chip capacitors used in pulsed filed can offer extraordinary discharge energy under elevated electric fields which can be used in high power pulse. However, the low energy density for dielectric ceramic limits the total discharge energy, instead, multilayer-structured design needs to be developed. The ensuing problem is to develop low-temperature sintered ceramics which can be used for the fabrication of multilayered ceramics by cofiring with low-cost Cu electrode. The present study aims to lower sintering temperature and tailors antiferroelectric performances of Cd-doped (Pb, La)(Sn, Zr, Ti)O3 (PCLSZT) ceramics by phase regulation. The case indicates that the modification of Cd largely reduces the sintering temperature, while Ti regulation can gradually induce an orthorhombic-tetragonal phase transition to optimize dielectric energy storage. The promising energy properties can be obtained (Pb0.955Cd0.015La0.02)(Sn0.5Zr0.45Ti0.05)O3 under a low field of 260 kV/cm with a charge energy density of 3.52 J/cm3, an energy efficiency of 85%, respectively, accompanied by a rapid discharge speed of t0.9 = 0.74 μs. This indicates the tunability of energy property in AFE Cd-doped PCLSZT ceramics, thereby providing a potential alternative to develop emerging materials for multilayered pulsed power components.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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