热压温度和二次烧结对LiZnTi铁氧体微观结构和回磁性能的影响

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Honglan Lai, Fang Xu, Hongwei Yang, Yan Yang, Yong Ren, Guixiang Liu, Bo Dai
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引用次数: 0

摘要

本研究首先对烧结温度为850 ~ 1050℃的LiZnTi铁氧体进行了热压烧结(HPS)。为了分析共烧的可行性,将烧结后的hps1样品在950℃下进行了传统的烧结(TS)工艺。系统地研究了烧结温度和二次烧结对LiZnTi铁氧体的晶相形成、显微结构和旋磁性能的影响。x射线衍射证实所有样品均表现出纯尖晶石结构。SEM图像表明,试样的晶粒尺寸和容重随温度的升高而增大。由于长时间的二次烧结,所有样品都表现出二次生长。磁滞回线(M-H)证实了烧结温度可以提高饱和磁化强度,样品在二次烧结后保持稳定。铁磁共振(FMR)线宽结果表明,1000hps1试样的线宽值较小(ΔH = 298.25 Oe),二次烧结后仍能保持较好的稳定值。因此,热压烧结制备的LiZnTi铁氧体样品可以与其他陶瓷(介电陶瓷)共烧用于微波应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The influences of hot-pressing temperature and second sintering on microstructure and gyromagnetic properties of LiZnTi ferrite

In this study, a hot-pressing sintering (HPS) was firstly performed for LiZnTi ferrites sintered from 850 to 1050 °C. To analyze feasibility of co-firing, the as-sintered HPS1st samples were then subjected to a traditional sintering (TS) process at 950 °C. The influences of sintering temperature and second sintering on the crystal phase formation, microstructure, and gyromagnetic properties of the LiZnTi ferrite were systematically investigated. X-ray diffraction confirmed that all the samples exhibited a pure spinel structure. SEM images indicated that the grain size and bulk density of the samples have increased with the increase in temperature. Due to the second sintering with a long time, all the samples exhibited a secondary growth. The magnetic hysteresis (M-H) loops confirmed that sintering temperature could enhance saturation magnetization intensity and the samples kept a stable value after second sintering. The results of ferromagnetic resonance (FMR) linewidths revealed that the 1000HPS1st sample had a small value (ΔH = 298.25 Oe) and could also keep a good and stable value after second sintering. Thus, the LiZnTi ferrite sample prepared by hot-pressing sintering was feasible for co-firing with other ceramic (dielectric ceramic) for microwave applications.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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