一种新的基于预测的双层ECC减轻HBM中SWD误差

IF 2.8 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Youngki Moon;Seung Ho Shin;Seokjun Jang;Duyeon Won;Sungho Kang
{"title":"一种新的基于预测的双层ECC减轻HBM中SWD误差","authors":"Youngki Moon;Seung Ho Shin;Seokjun Jang;Duyeon Won;Sungho Kang","doi":"10.1109/TVLSI.2024.3474791","DOIUrl":null,"url":null,"abstract":"Errors emerge as a major issue in the reliability of dynamic random access memory (DRAM). To enhance reliability, a two-tiered error correction code (ECC) architecture that comprises on-die ECC (OD-ECC) and system ECC (S-ECC) is adopted as a part of the standard for state-of-the-art high-bandwidth memory (HBM). However, conventional ECCs are insufficient to mitigate malfunctions of subwordline drivers (SWDs), a primary cause of errors. Moreover, the efficient co-design of two-tiered ECCs has not been sufficiently studied. To address these issues without increasing the size of check bits, this article proposes a two-tiered ECC architecture comprising an OD-ECC based on prediction and an S-ECC with data deinterleaving. The proposed OD-ECC predicts the SWD errors by leveraging the detection capabilities of two interleaved Reed-Solomon (RS) engines. In addition, the proposed S-ECC not only preserves strong error detection capability but also masks the misprediction effect of OD-ECC, where data deinterleaving renders additional errors caused by misprediction of OD-ECC to be bounded in the detectable range of the employed cyclic redundancy check (CRC). The experimental results demonstrate that the proposed two-tiered ECC can significantly enhance the error correction capability for SWD errors while maintaining the correction capability for other types of errors.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 2","pages":"488-498"},"PeriodicalIF":2.8000,"publicationDate":"2024-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Novel Prediction-Based Two-Tiered ECC for Mitigating SWD Errors in HBM\",\"authors\":\"Youngki Moon;Seung Ho Shin;Seokjun Jang;Duyeon Won;Sungho Kang\",\"doi\":\"10.1109/TVLSI.2024.3474791\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Errors emerge as a major issue in the reliability of dynamic random access memory (DRAM). To enhance reliability, a two-tiered error correction code (ECC) architecture that comprises on-die ECC (OD-ECC) and system ECC (S-ECC) is adopted as a part of the standard for state-of-the-art high-bandwidth memory (HBM). However, conventional ECCs are insufficient to mitigate malfunctions of subwordline drivers (SWDs), a primary cause of errors. Moreover, the efficient co-design of two-tiered ECCs has not been sufficiently studied. To address these issues without increasing the size of check bits, this article proposes a two-tiered ECC architecture comprising an OD-ECC based on prediction and an S-ECC with data deinterleaving. The proposed OD-ECC predicts the SWD errors by leveraging the detection capabilities of two interleaved Reed-Solomon (RS) engines. In addition, the proposed S-ECC not only preserves strong error detection capability but also masks the misprediction effect of OD-ECC, where data deinterleaving renders additional errors caused by misprediction of OD-ECC to be bounded in the detectable range of the employed cyclic redundancy check (CRC). The experimental results demonstrate that the proposed two-tiered ECC can significantly enhance the error correction capability for SWD errors while maintaining the correction capability for other types of errors.\",\"PeriodicalId\":13425,\"journal\":{\"name\":\"IEEE Transactions on Very Large Scale Integration (VLSI) Systems\",\"volume\":\"33 2\",\"pages\":\"488-498\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-10-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Very Large Scale Integration (VLSI) Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10726615/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10726615/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0

摘要

错误是动态随机存取存储器(DRAM)可靠性中的一个主要问题。为了提高可靠性,采用了两层ECC (error correction code)架构,包括片上ECC (OD-ECC)和系统ECC (S-ECC),作为最先进的高带宽内存(HBM)标准的一部分。然而,传统的ECCs不足以减轻子词线驱动程序(swd)的故障,这是导致错误的主要原因。此外,两层ECCs的有效协同设计还没有得到充分研究。为了在不增加校验位大小的情况下解决这些问题,本文提出了一种两层ECC架构,包括基于预测的OD-ECC和具有数据去交错的S-ECC。提出的OD-ECC通过利用两个交错Reed-Solomon (RS)引擎的检测能力来预测SWD误差。此外,本文提出的S-ECC不仅保留了强大的错误检测能力,而且掩盖了OD-ECC的误预测效应,其中数据去交错使得OD-ECC误预测引起的额外错误被限制在所采用的循环冗余校验(CRC)的可检测范围内。实验结果表明,本文提出的两层ECC在保持对其他类型错误的纠错能力的同时,显著增强了对SWD错误的纠错能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Novel Prediction-Based Two-Tiered ECC for Mitigating SWD Errors in HBM
Errors emerge as a major issue in the reliability of dynamic random access memory (DRAM). To enhance reliability, a two-tiered error correction code (ECC) architecture that comprises on-die ECC (OD-ECC) and system ECC (S-ECC) is adopted as a part of the standard for state-of-the-art high-bandwidth memory (HBM). However, conventional ECCs are insufficient to mitigate malfunctions of subwordline drivers (SWDs), a primary cause of errors. Moreover, the efficient co-design of two-tiered ECCs has not been sufficiently studied. To address these issues without increasing the size of check bits, this article proposes a two-tiered ECC architecture comprising an OD-ECC based on prediction and an S-ECC with data deinterleaving. The proposed OD-ECC predicts the SWD errors by leveraging the detection capabilities of two interleaved Reed-Solomon (RS) engines. In addition, the proposed S-ECC not only preserves strong error detection capability but also masks the misprediction effect of OD-ECC, where data deinterleaving renders additional errors caused by misprediction of OD-ECC to be bounded in the detectable range of the employed cyclic redundancy check (CRC). The experimental results demonstrate that the proposed two-tiered ECC can significantly enhance the error correction capability for SWD errors while maintaining the correction capability for other types of errors.
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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