{"title":"微波强化超分子胶粘剂:从柔性压敏粘接到强而多可重复使用的热熔胶粘接","authors":"Yuquan Li, Siyuan Liu, Jiang-Fei Xu, Xi Zhang","doi":"10.1002/smll.202412251","DOIUrl":null,"url":null,"abstract":"A microwave-strengthened supramolecular adhesive by introducing maleic acid amide bonds into the cross-linked networks of catechol-based monomers and iron oxide nanoparticles is reported. Under microwave irradiation, the supramolecular adhesive can be rapidly heated up, causing the transformation from maleic acid amide bonds to maleimide bonds and thus the increase of its cohesive strength. The supramolecular adhesive can flexibly bond substrates like pressure sensitive adhesives during the bonding procedure and shows an adhesion strength of 0.5 MPa toward ceramic. After microwave strengthening, it can strongly bond substrates like hot melt adhesives and shows a dramatically increased adhesion strength of 5.0 MPa, 10 times stronger than the original value. Moreover, the microwave-strengthened supramolecular adhesive can be reused 3 times with negligible loss in adhesion strength, exhibiting outstanding multiple reusability. By combining both high flexibility and high adhesion strength, it is anticipated that the supramolecular adhesive can be of great potential in cultural relics restoration and microelectronics.","PeriodicalId":228,"journal":{"name":"Small","volume":"137 1","pages":""},"PeriodicalIF":13.0000,"publicationDate":"2025-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Microwave-Strengthened Supramolecular Adhesive: from Flexible Pressure Sensitive Bonding to Strong and Muti-Reusable Hot Melt Bonding\",\"authors\":\"Yuquan Li, Siyuan Liu, Jiang-Fei Xu, Xi Zhang\",\"doi\":\"10.1002/smll.202412251\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A microwave-strengthened supramolecular adhesive by introducing maleic acid amide bonds into the cross-linked networks of catechol-based monomers and iron oxide nanoparticles is reported. Under microwave irradiation, the supramolecular adhesive can be rapidly heated up, causing the transformation from maleic acid amide bonds to maleimide bonds and thus the increase of its cohesive strength. The supramolecular adhesive can flexibly bond substrates like pressure sensitive adhesives during the bonding procedure and shows an adhesion strength of 0.5 MPa toward ceramic. After microwave strengthening, it can strongly bond substrates like hot melt adhesives and shows a dramatically increased adhesion strength of 5.0 MPa, 10 times stronger than the original value. Moreover, the microwave-strengthened supramolecular adhesive can be reused 3 times with negligible loss in adhesion strength, exhibiting outstanding multiple reusability. By combining both high flexibility and high adhesion strength, it is anticipated that the supramolecular adhesive can be of great potential in cultural relics restoration and microelectronics.\",\"PeriodicalId\":228,\"journal\":{\"name\":\"Small\",\"volume\":\"137 1\",\"pages\":\"\"},\"PeriodicalIF\":13.0000,\"publicationDate\":\"2025-01-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Small\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1002/smll.202412251\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"CHEMISTRY, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Small","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1002/smll.202412251","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
A Microwave-Strengthened Supramolecular Adhesive: from Flexible Pressure Sensitive Bonding to Strong and Muti-Reusable Hot Melt Bonding
A microwave-strengthened supramolecular adhesive by introducing maleic acid amide bonds into the cross-linked networks of catechol-based monomers and iron oxide nanoparticles is reported. Under microwave irradiation, the supramolecular adhesive can be rapidly heated up, causing the transformation from maleic acid amide bonds to maleimide bonds and thus the increase of its cohesive strength. The supramolecular adhesive can flexibly bond substrates like pressure sensitive adhesives during the bonding procedure and shows an adhesion strength of 0.5 MPa toward ceramic. After microwave strengthening, it can strongly bond substrates like hot melt adhesives and shows a dramatically increased adhesion strength of 5.0 MPa, 10 times stronger than the original value. Moreover, the microwave-strengthened supramolecular adhesive can be reused 3 times with negligible loss in adhesion strength, exhibiting outstanding multiple reusability. By combining both high flexibility and high adhesion strength, it is anticipated that the supramolecular adhesive can be of great potential in cultural relics restoration and microelectronics.
期刊介绍:
Small serves as an exceptional platform for both experimental and theoretical studies in fundamental and applied interdisciplinary research at the nano- and microscale. The journal offers a compelling mix of peer-reviewed Research Articles, Reviews, Perspectives, and Comments.
With a remarkable 2022 Journal Impact Factor of 13.3 (Journal Citation Reports from Clarivate Analytics, 2023), Small remains among the top multidisciplinary journals, covering a wide range of topics at the interface of materials science, chemistry, physics, engineering, medicine, and biology.
Small's readership includes biochemists, biologists, biomedical scientists, chemists, engineers, information technologists, materials scientists, physicists, and theoreticians alike.