甲基纤维素结晶性原理及其在铜基电子糊中的应用

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Xingyu Zhou, Shenghua Ma, Hui Wang
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引用次数: 0

摘要

纤维素作为一种大分子物质,其链之间容易形成相互作用力,最终导致结晶区域的产生。本文采用抗坏血酸的可逆脱氢反应,脱氢抗坏血酸与甲基纤维素分子链上的羟基结合形成氢键,目的是占据分子链上的羟基,抑制链间氢键的形成,从而消除甲基纤维素的结晶区。利用傅里叶变换红外光谱(FTIR)和x射线衍射(XRD)分析了氢键的改变和晶体区域的消除。同时,还配制了铜膏。铜的加入导致抗坏血酸在200℃范围内的氧化加剧。这导致草酸的形成,随后与铜在高温下形成草酸铜。这个过程然后进入抗坏血酸胶体,形成一个导电通道。根据原理设计并制备了低温烧结铜膏,该铜膏具有高粘度回收率(75.8%)、高附附性、低电阻率(4.2*10−6Ω*cm)和丝网印刷后物镜长宽比(0.28)等特点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The principle of methylcellulose crystallinity and its application in copper-based electronic pastes

As a macromolecular substance, cellulose is susceptible to the formation of interaction forces between its chains, which ultimately result in the generation of crystalline regions. In this paper, the reversible dehydrogenation reaction of ascorbic acid is employed, whereby the combination of dehydroascorbic acid and the hydroxyl group on the molecular chain of methylcellulose forms hydrogen bonding with the purpose of occupying the hydroxyl group on the molecular chain and inhibiting the formation of hydrogen bonding between the chains, thus eliminating the crystalline zone of methylcellulose. The alteration of hydrogen bonding and the elimination of the crystalline region were identified through the utilization of Fourier transform infrared (FTIR) spectroscopy and X-ray diffraction (XRD). Concurrently, a copper paste is formulated. The addition of copper results in the intensification of the oxidation of ascorbic acid at temperatures in the range of 200 °C. This leads to the formation of oxalic acid, which subsequently forms copper oxalate with copper at high temperatures. This process then enters the ascorbic acid colloid, forming a conductive channel. In accordance with the principles, a low-temperature sintered copper paste was devised and manufactured, exhibiting a high viscosity recovery rate (75.8%), high adhesion, low resistivity (4.2*10−6Ω*cm), and objective aspect ratio (0.28) after screen printing.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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