级联码增益和功率提升及并联电容匹配改进的e波段功率放大器设计

0 ENGINEERING, ELECTRICAL & ELECTRONIC
Yuen-Sum Ng;Yunshan Wang;Huei Wang
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引用次数: 0

摘要

本文介绍了一种采用65纳米CMOS技术制造的e波段功率放大器(PA)。该放大器采用三级设计方法和级联结构来扩展电源电压,以获得更高的增益和输出功率。利用双向功率组合技术进一步提高了传输功率。通过引入额外的并联电容,在功率级之前的级间匹配中降低了插入损耗。该放大器利用变压器耦合技术进行级间连接和紧凑的布局技术,使其适合毫米波(mmW)应用。在1.2 V和2.4 V的多路电源电压和150 mA和220 mA的80 GHz电流消耗下,PA分别提供21.2 dBm的饱和输出功率($P_{\ mathm {sat}}$)、24.6 dB的换能器增益和20.6%的功率附加效率(PAE)。该PA占据的核心芯片尺寸为$800\ × 360~\mu $ m。据作者所知,这是第一次发表在级联码配置下使用并联电容来提高性能的文章。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of the E-Band Power Amplifier With Cascode Gain- and Power-Boosting and Shunt Capacitance Matching Improvement
This letter presents an E-band power amplifier (PA) fabricated in 65-nm CMOS technology. This PA adopts a three-stage design approach and a cascode structure to extend the supply voltage for higher gain and output power. The two-way power-combining technique is exploited to further improve the power delivered. By introducing an additional shunt capacitance, the insertion loss is reduced in the interstage matching before the power stage. This PA exploits the transformer coupling technique for interstage connection and compact layout techniques to make the PA suitable for millimeter-wave (mmW) applications. The PA provides 21.2 dBm of saturated output power ( $P_{\mathrm {sat}}$ ), 24.6 dB of transducer gain, and 20.6% of power-added efficiency (PAE) under a multiple supply voltage of 1.2 and 2.4 V and current consumption of 150 and 220 mA at 80 GHz, respectively. The PA occupies a core die size of $800\times 360~\mu $ m. To the author’s knowledge, it is the first publication to improve the performance using shunt capacitance to improve the performance under cascode configuration.
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