基于焦二甲基二酐的高度耐热和可溶性端苯基乙基热固性亚胺低聚物

IF 4.1 2区 化学 Q2 POLYMER SCIENCE
Minghui Bai, Chunshan Lu, Guofei Chen, Xingzhong Fang
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引用次数: 0

摘要

摘要在4-苯基乙基苯酐(4- pepa)为封端剂的条件下,将邻苯二酐(PMDA)与双(4-氨基- 2 -三氟甲基苯基)醚(TFODA)和2,2′-双(三氟甲基)联苯胺(TFDB)热缩聚制备了一系列热固性亚胺低聚物。研究了不同二胺比和不同分子量对亚胺低聚物溶解度和熔体粘度的影响,以及对固化聚酰亚胺片材热力学性能的影响。实验结果表明,亚胺低聚物PI-1、PI-2、PI-3和PI-4在普通溶剂中具有良好的溶解度(≥33 wt%)。其中,PI-2的加工性能最好,熔体粘度最小为4.8 Pa·s。在371℃下热固化2.5 h后,固化后的聚酰亚胺片材在空气和N2气氛下的玻璃化转变温度(Tgs)为413 ~ 472℃,失重温度(td5%)为560 ~ 578℃,韧性良好,伸长率为8.6 ~ 19.1%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Highly heat-resistant and soluble phenylethynyl-terminated thermoset imide oligomers based on pyromellitic dianhydride

Highly heat-resistant and soluble phenylethynyl-terminated thermoset imide oligomers based on pyromellitic dianhydride
A series of thermoset imide oligomers have been prepared by the thermal polycondensation of pyromellitic dianhydride (PMDA) with two different aromatic diamines, bis(4‐amino‐2‐trifluoromethylphenyl)ether (TFODA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) in the presence of 4-phenylethynylphthalic anhydride (4-PEPA) as an end-capping reagent. The effects of different diamine ratios and different molecular weights on the solubility and melt viscosity of imide oligomers, as well as on the thermal and mechanical properties of cured polyimide sheets were investigated. The experimental results showed that the imide oligomers PI-1, PI-2, PI-3, and PI-4 exhibited good solubility (≥33 wt%) in common solvents. Among them, PI-2 showed the best processing properties with a minimum melt viscosity of 4.8 Pa·s. After thermally curing at 371 °C for 2.5 h, the cured polyimide sheets showed glass transition temperatures (Tgs) of 413-472 °C, 5% weight loss temperatures (Td5%s) of 560-578 °C in both air and N2 atmosphere, and good toughness with elongation of 8.6-19.1%.
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来源期刊
Polymer
Polymer 化学-高分子科学
CiteScore
7.90
自引率
8.70%
发文量
959
审稿时长
32 days
期刊介绍: Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics. The main scope is covered but not limited to the following core areas: Polymer Materials Nanocomposites and hybrid nanomaterials Polymer blends, films, fibres, networks and porous materials Physical Characterization Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films Polymer Engineering Advanced multiscale processing methods Polymer Synthesis, Modification and Self-assembly Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization Technological Applications Polymers for energy generation and storage Polymer membranes for separation technology Polymers for opto- and microelectronics.
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