Zhenbao Li, Guoqing Liu, Gaofeng Jiao, Xiaoyan Xu, Qingbin Hao, Kai Yao, Jianfeng Li
{"title":"在Bi-2212前驱体粉末中少量加入纯14:24AEC可使Bi-2212超导膜的Jc提高一倍","authors":"Zhenbao Li, Guoqing Liu, Gaofeng Jiao, Xiaoyan Xu, Qingbin Hao, Kai Yao, Jianfeng Li","doi":"10.1007/s10854-024-14122-x","DOIUrl":null,"url":null,"abstract":"<div><p>Pure (Sr,Ca)<sub>14</sub>Cu<sub>24</sub>O<sub>x</sub>(14:24AEC) was prepared and added into Bi<sub>2.1</sub>Sr<sub>1.96</sub>Ca<sub>1.0</sub>Cu<sub>2.0</sub>O<sub>x</sub>(Bi-2212) precursor powder to prepare Bi-2212 superconducting films for the first time. Utilizing the dip coating method and partial melting process (PMP), three distinct Bi-2212 superconducting films were fabricated using Bi-2212 powders with the addition of 0 wt%, 1 wt%, and 3 wt% of 14:24AEC, respectively. It was discovered the addition of 1 wt% 14:24AEC optimized the Sr-to-Ca ratio in the Bi-2212 film (Bi-2212-1%), leading to a more consistent phase evolution for both 14:24AEC and Bi<sub>9</sub>Sr<sub>11</sub>Ca<sub>5</sub>O<sub>x</sub>(9:16CF), and resulting in the highest purity and texture of Bi-2212 among the samples. Consequently, Bi-2212-1% exhibited the highest critical current density(<i>J</i><sub><i>c</i></sub>), and its <i>J</i><sub><i>c</i></sub> doubled that of the Bi-2212 film without the addition of 14:24AEC. This study suggests that the addition of pure 14:24AEC into Bi-2212 precursor powders could significantly enhance the <i>J</i><sub><i>c</i></sub> of Bi-2212 wires in future applications.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 1","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2024-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Doubled Jc of Bi-2212 superconducting films by small addition of pure 14:24AEC in Bi-2212 precursor powder\",\"authors\":\"Zhenbao Li, Guoqing Liu, Gaofeng Jiao, Xiaoyan Xu, Qingbin Hao, Kai Yao, Jianfeng Li\",\"doi\":\"10.1007/s10854-024-14122-x\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Pure (Sr,Ca)<sub>14</sub>Cu<sub>24</sub>O<sub>x</sub>(14:24AEC) was prepared and added into Bi<sub>2.1</sub>Sr<sub>1.96</sub>Ca<sub>1.0</sub>Cu<sub>2.0</sub>O<sub>x</sub>(Bi-2212) precursor powder to prepare Bi-2212 superconducting films for the first time. Utilizing the dip coating method and partial melting process (PMP), three distinct Bi-2212 superconducting films were fabricated using Bi-2212 powders with the addition of 0 wt%, 1 wt%, and 3 wt% of 14:24AEC, respectively. It was discovered the addition of 1 wt% 14:24AEC optimized the Sr-to-Ca ratio in the Bi-2212 film (Bi-2212-1%), leading to a more consistent phase evolution for both 14:24AEC and Bi<sub>9</sub>Sr<sub>11</sub>Ca<sub>5</sub>O<sub>x</sub>(9:16CF), and resulting in the highest purity and texture of Bi-2212 among the samples. Consequently, Bi-2212-1% exhibited the highest critical current density(<i>J</i><sub><i>c</i></sub>), and its <i>J</i><sub><i>c</i></sub> doubled that of the Bi-2212 film without the addition of 14:24AEC. This study suggests that the addition of pure 14:24AEC into Bi-2212 precursor powders could significantly enhance the <i>J</i><sub><i>c</i></sub> of Bi-2212 wires in future applications.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"36 1\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-12-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-024-14122-x\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-024-14122-x","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Doubled Jc of Bi-2212 superconducting films by small addition of pure 14:24AEC in Bi-2212 precursor powder
Pure (Sr,Ca)14Cu24Ox(14:24AEC) was prepared and added into Bi2.1Sr1.96Ca1.0Cu2.0Ox(Bi-2212) precursor powder to prepare Bi-2212 superconducting films for the first time. Utilizing the dip coating method and partial melting process (PMP), three distinct Bi-2212 superconducting films were fabricated using Bi-2212 powders with the addition of 0 wt%, 1 wt%, and 3 wt% of 14:24AEC, respectively. It was discovered the addition of 1 wt% 14:24AEC optimized the Sr-to-Ca ratio in the Bi-2212 film (Bi-2212-1%), leading to a more consistent phase evolution for both 14:24AEC and Bi9Sr11Ca5Ox(9:16CF), and resulting in the highest purity and texture of Bi-2212 among the samples. Consequently, Bi-2212-1% exhibited the highest critical current density(Jc), and its Jc doubled that of the Bi-2212 film without the addition of 14:24AEC. This study suggests that the addition of pure 14:24AEC into Bi-2212 precursor powders could significantly enhance the Jc of Bi-2212 wires in future applications.
期刊介绍：
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
