室温下能量滤波增强Cu2−xS混合相膜的Seebeck系数

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Lahoucine Amiri, Ahmad Alsaad, Abdelfattah Narjis, Chi-Te Liang, Abdellah Tihane, Said Elmassi, Lahcen Nkhaili
{"title":"室温下能量滤波增强Cu2−xS混合相膜的Seebeck系数","authors":"Lahoucine Amiri,&nbsp;Ahmad Alsaad,&nbsp;Abdelfattah Narjis,&nbsp;Chi-Te Liang,&nbsp;Abdellah Tihane,&nbsp;Said Elmassi,&nbsp;Lahcen Nkhaili","doi":"10.1007/s11664-024-11553-4","DOIUrl":null,"url":null,"abstract":"<div><p>In this work, we present and report on the evolution of thermoelectric properties altered through changes in the energy barrier height in thermally evaporated mixed-phase copper sulfide thin films. The physical interpretations depend on the conception of degenerate energy levels near the top of the valence band. The energy barrier at grain boundaries was highlighted and assumed to be the origin of the rapid evolution of the conductivity and Seebeck coefficient of the film annealed at 723 K. The position of the energy levels of the active carriers with respect to the Fermi energy reinforces the effect of annealing temperature on the Seebeck coefficient and electrical conductivity and was observed to transform the system from a system with fully ionized impurities to a system with impurities that are not fully ionized, which enhances the barrier height. The evolution of the Seebeck coefficient is explained in terms of thermal activation. The sample annealed at 623 K exhibited the lowest barrier height of 32 meV, with an activation energy of 111 meV. The sample annealed at 673 K had a barrier height of 46 meV with an activation energy of 136 meV. Finally, the sample annealed at 723 K exhibited a barrier height of 103 meV, which explains its relatively high room-temperature Seebeck coefficient, with a pronounced effect of temperature.</p></div>","PeriodicalId":626,"journal":{"name":"Journal of Electronic Materials","volume":"54 1","pages":"426 - 431"},"PeriodicalIF":2.2000,"publicationDate":"2024-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Enhancement of the Seebeck Coefficient by Energy Filtering in Mixed-Phase Cu2−xS Films at Room Temperature\",\"authors\":\"Lahoucine Amiri,&nbsp;Ahmad Alsaad,&nbsp;Abdelfattah Narjis,&nbsp;Chi-Te Liang,&nbsp;Abdellah Tihane,&nbsp;Said Elmassi,&nbsp;Lahcen Nkhaili\",\"doi\":\"10.1007/s11664-024-11553-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>In this work, we present and report on the evolution of thermoelectric properties altered through changes in the energy barrier height in thermally evaporated mixed-phase copper sulfide thin films. The physical interpretations depend on the conception of degenerate energy levels near the top of the valence band. The energy barrier at grain boundaries was highlighted and assumed to be the origin of the rapid evolution of the conductivity and Seebeck coefficient of the film annealed at 723 K. The position of the energy levels of the active carriers with respect to the Fermi energy reinforces the effect of annealing temperature on the Seebeck coefficient and electrical conductivity and was observed to transform the system from a system with fully ionized impurities to a system with impurities that are not fully ionized, which enhances the barrier height. The evolution of the Seebeck coefficient is explained in terms of thermal activation. The sample annealed at 623 K exhibited the lowest barrier height of 32 meV, with an activation energy of 111 meV. The sample annealed at 673 K had a barrier height of 46 meV with an activation energy of 136 meV. Finally, the sample annealed at 723 K exhibited a barrier height of 103 meV, which explains its relatively high room-temperature Seebeck coefficient, with a pronounced effect of temperature.</p></div>\",\"PeriodicalId\":626,\"journal\":{\"name\":\"Journal of Electronic Materials\",\"volume\":\"54 1\",\"pages\":\"426 - 431\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2024-11-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Materials\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s11664-024-11553-4\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s11664-024-11553-4","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

在这项工作中,我们提出并报告了热蒸发混合相硫化铜薄膜中能量势垒高度变化所改变的热电性能的演变。物理解释依赖于价带顶部附近简并能级的概念。强调了晶界处的能量势垒,并认为这是723 K退火后薄膜电导率和塞贝克系数快速演变的原因。活性载流子能级相对于费米能的位置加强了退火温度对塞贝克系数和电导率的影响,并观察到将系统从具有完全电离杂质的系统转变为具有未完全电离杂质的系统,从而提高了势垒高度。塞贝克系数的演化用热活化来解释。623 K退火样品的势垒高度最低为32 meV,活化能为111 meV。673 K退火后的样品势垒高度为46 meV,活化能为136 meV。最后,在723 K退火的样品显示出103 meV的势垒高度,这解释了其相对较高的室温塞贝克系数,并且温度的影响明显。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Enhancement of the Seebeck Coefficient by Energy Filtering in Mixed-Phase Cu2−xS Films at Room Temperature

Enhancement of the Seebeck Coefficient by Energy Filtering in Mixed-Phase Cu2−xS Films at Room Temperature

In this work, we present and report on the evolution of thermoelectric properties altered through changes in the energy barrier height in thermally evaporated mixed-phase copper sulfide thin films. The physical interpretations depend on the conception of degenerate energy levels near the top of the valence band. The energy barrier at grain boundaries was highlighted and assumed to be the origin of the rapid evolution of the conductivity and Seebeck coefficient of the film annealed at 723 K. The position of the energy levels of the active carriers with respect to the Fermi energy reinforces the effect of annealing temperature on the Seebeck coefficient and electrical conductivity and was observed to transform the system from a system with fully ionized impurities to a system with impurities that are not fully ionized, which enhances the barrier height. The evolution of the Seebeck coefficient is explained in terms of thermal activation. The sample annealed at 623 K exhibited the lowest barrier height of 32 meV, with an activation energy of 111 meV. The sample annealed at 673 K had a barrier height of 46 meV with an activation energy of 136 meV. Finally, the sample annealed at 723 K exhibited a barrier height of 103 meV, which explains its relatively high room-temperature Seebeck coefficient, with a pronounced effect of temperature.

求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Electronic Materials
Journal of Electronic Materials 工程技术-材料科学:综合
CiteScore
4.10
自引率
4.80%
发文量
693
审稿时长
3.8 months
期刊介绍: The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field. A journal of The Minerals, Metals & Materials Society.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信