{"title":"具有 2.4 GHz LO 同步功能的 W 波段 TX/RX 芯片组,可实现 FMCW 雷达的全面可扩展性","authors":"Jingzhi Zhang;Sherif S. Ahmed;Amin Arbabian","doi":"10.1109/JSSC.2024.3514667","DOIUrl":null,"url":null,"abstract":"The chip-cascading solution has been widely used in millimeter-wave (mm-wave) frequency-modulated continuous wave (FMCW) radars to enable large-aperture arrays in multiple-input and multiple-output (MIMO) operations. However, scalability remains problematic during implementation. In this work, we propose a W-band FMCW radar transceiver chip architecture to enable full scalability by adopting an local oscillator (LO) distribution frequency as low as 2.4 GHz for cross-chip synchronization. Implemented in the 40-nm CMOS process, we demonstrate a four-channel receiver chip and a single-channel transmitter chip that can operate from 80 to 90 GHz. Meanwhile, we use a ceramic interposer with integrated patch antennas to package the chips to achieve antenna-in-package (AiP). To reconstruct the 84-GHz FMCW chirp signal from the off-chip 2.4-GHz LO distribution chain, we design an on-chip injection-locking-based <inline-formula> <tex-math>${\\times }35$ </tex-math></inline-formula> frequency multiplier, while the phase noise and harmonic spur issues during reconstruction have been analyzed and carefully arranged. The measured phase noise and harmonic rejection ratio (HRR) are -112 dBc/Hz at 1-MHz offset and above 50 dBc, respectively, allowing for an over 100-dB radar dynamic range. We demonstrate a radar system by cascading two receiver chips and two transmitter chips to enable an <inline-formula> <tex-math>$8 \\times 2$ </tex-math></inline-formula> MIMO array, and achieve an 11.3° angular resolution through an outdoor experiment. Prototype radar systems enable for advanced chip cascading, which is beneficial for next-generation scalable high-resolution imaging radars.","PeriodicalId":13129,"journal":{"name":"IEEE Journal of Solid-state Circuits","volume":"60 8","pages":"2736-2750"},"PeriodicalIF":5.6000,"publicationDate":"2024-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A W-Band TX/RX Chipset With 2.4-GHz LO Synchronization Enabling Full Scalability for FMCW Radar\",\"authors\":\"Jingzhi Zhang;Sherif S. Ahmed;Amin Arbabian\",\"doi\":\"10.1109/JSSC.2024.3514667\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The chip-cascading solution has been widely used in millimeter-wave (mm-wave) frequency-modulated continuous wave (FMCW) radars to enable large-aperture arrays in multiple-input and multiple-output (MIMO) operations. However, scalability remains problematic during implementation. In this work, we propose a W-band FMCW radar transceiver chip architecture to enable full scalability by adopting an local oscillator (LO) distribution frequency as low as 2.4 GHz for cross-chip synchronization. Implemented in the 40-nm CMOS process, we demonstrate a four-channel receiver chip and a single-channel transmitter chip that can operate from 80 to 90 GHz. Meanwhile, we use a ceramic interposer with integrated patch antennas to package the chips to achieve antenna-in-package (AiP). To reconstruct the 84-GHz FMCW chirp signal from the off-chip 2.4-GHz LO distribution chain, we design an on-chip injection-locking-based <inline-formula> <tex-math>${\\\\times }35$ </tex-math></inline-formula> frequency multiplier, while the phase noise and harmonic spur issues during reconstruction have been analyzed and carefully arranged. The measured phase noise and harmonic rejection ratio (HRR) are -112 dBc/Hz at 1-MHz offset and above 50 dBc, respectively, allowing for an over 100-dB radar dynamic range. We demonstrate a radar system by cascading two receiver chips and two transmitter chips to enable an <inline-formula> <tex-math>$8 \\\\times 2$ </tex-math></inline-formula> MIMO array, and achieve an 11.3° angular resolution through an outdoor experiment. Prototype radar systems enable for advanced chip cascading, which is beneficial for next-generation scalable high-resolution imaging radars.\",\"PeriodicalId\":13129,\"journal\":{\"name\":\"IEEE Journal of Solid-state Circuits\",\"volume\":\"60 8\",\"pages\":\"2736-2750\"},\"PeriodicalIF\":5.6000,\"publicationDate\":\"2024-12-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Journal of Solid-state Circuits\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10805088/\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal of Solid-state Circuits","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10805088/","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A W-Band TX/RX Chipset With 2.4-GHz LO Synchronization Enabling Full Scalability for FMCW Radar
The chip-cascading solution has been widely used in millimeter-wave (mm-wave) frequency-modulated continuous wave (FMCW) radars to enable large-aperture arrays in multiple-input and multiple-output (MIMO) operations. However, scalability remains problematic during implementation. In this work, we propose a W-band FMCW radar transceiver chip architecture to enable full scalability by adopting an local oscillator (LO) distribution frequency as low as 2.4 GHz for cross-chip synchronization. Implemented in the 40-nm CMOS process, we demonstrate a four-channel receiver chip and a single-channel transmitter chip that can operate from 80 to 90 GHz. Meanwhile, we use a ceramic interposer with integrated patch antennas to package the chips to achieve antenna-in-package (AiP). To reconstruct the 84-GHz FMCW chirp signal from the off-chip 2.4-GHz LO distribution chain, we design an on-chip injection-locking-based ${\times }35$ frequency multiplier, while the phase noise and harmonic spur issues during reconstruction have been analyzed and carefully arranged. The measured phase noise and harmonic rejection ratio (HRR) are -112 dBc/Hz at 1-MHz offset and above 50 dBc, respectively, allowing for an over 100-dB radar dynamic range. We demonstrate a radar system by cascading two receiver chips and two transmitter chips to enable an $8 \times 2$ MIMO array, and achieve an 11.3° angular resolution through an outdoor experiment. Prototype radar systems enable for advanced chip cascading, which is beneficial for next-generation scalable high-resolution imaging radars.
期刊介绍:
The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.