利用溅射技术沉积的二氧化钛薄膜光催化剂实现二氧化碳光转化

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
M. R. Alfaro Cruz, O. Ceballos-Sanchez, G. A. Rodríguez-Rocha, L. M. Torres-Martínez
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CO2 photoconversion using photocatalyst of TiO2 thin films deposited by sputtering technique

TiO2 thin films were used as photocatalysts in CO2 photoconversion to solar fuels under UV irradiation. The films were deposited via sputtering while varying the working pressure for each deposition and could produce CH2O2 and CH3OH. According to Raman results, the films Ti-1 (3.87 Pa) and Ti-2 (3.73 Pa) deposited at high working pressure have a higher contribution of brookite phase compared with the films Ti-3 (3.47 Pa) and Ti-4 (3.33 Pa) obtained at low working pressure. Likewise, a higher presence of the brookite phase increases the atomic concentration of C–O bonds and OH groups on the film surface, which reaches the CO2 photoconversion, as the TiO2 capacity to adsorb CO2 on the surface is determined by the O and C species present in the film. Therefore, the films Ti-1 and Ti-2, deposited at high working pressures and significantly contributing to the brookite phase, can produce 0.56 and 0.94 μmol of CH3OH, respectively. Meanwhile, according to the Raman and XPS results, the highest formic acid production was obtained from the Ti-3 and Ti-4 films, which show a less brookite phase presence and a higher contribution of O2− ions in TiO2.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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