用于制造高坚固保形电子器件的根启发、模板限制添加打印技术。

IF 7.3 1区 工程技术 Q1 INSTRUMENTS & INSTRUMENTATION
Guifang Liu, Xiangming Li, Yangfan Qiu, Chuanhang Zeng, Xinkai Zhu, Chao Wang, Xiaoliang Chen, Chunhui Wang, Hongmiao Tian, Jinyou Shao
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引用次数: 0

摘要

本文章由计算机程序翻译,如有差异,请以英文原文为准。
Root-inspired, template-confined additive printing for fabricating high-robust conformal electronics.

Conformal electronic devices on freeform surface play a critical role in the emerging smart robotics, smart skins, and integrated sensing systems. However, their functional structures such as circuits tend to tear-off, break, or crack under mechanical or thermal influence when in service, thus limiting the application reliability of conformal electronics. Herein, inspired by the tree root system, template-confined additive (TCA) printing technology was presented for reliable fabrication of robust circuits. TCA printing technology involves the penetration of adhesive into the functional material, thereby enhancing the mechanical robustness of the circuits, allowing them to maintain their electrical performance despite the presence of external damaging factors such as scratching, abrasion, folding, and high temperatures. For example, herein, the circuits could withstand mechanical abrasion at temperatures as high as 350 °C without compromising electrical properties. Benefiting from the confines of template, the printed circuits achieved resolutions of up to 300 nm, suitable for various materials such as P(VDF-TrFE), MWCNTs, and AgNPs, which enabled the multi-material self-aligned fabrication. Furthermore, the versatility of TCA printing was presented by fabricating circuits on arbitrary substrates, and realizing various devices, such as conformal temperature/humidity sensing system and epidermal ultra-thin energy storage system. These applications present the significant potential of TCA printing in fabricating intelligent devices.

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来源期刊
Microsystems & Nanoengineering
Microsystems & Nanoengineering Materials Science-Materials Science (miscellaneous)
CiteScore
12.00
自引率
3.80%
发文量
123
审稿时长
20 weeks
期刊介绍: Microsystems & Nanoengineering is a comprehensive online journal that focuses on the field of Micro and Nano Electro Mechanical Systems (MEMS and NEMS). It provides a platform for researchers to share their original research findings and review articles in this area. The journal covers a wide range of topics, from fundamental research to practical applications. Published by Springer Nature, in collaboration with the Aerospace Information Research Institute, Chinese Academy of Sciences, and with the support of the State Key Laboratory of Transducer Technology, it is an esteemed publication in the field. As an open access journal, it offers free access to its content, allowing readers from around the world to benefit from the latest developments in MEMS and NEMS.
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