相变存储用Sn和Al掺杂Se-Te硫系玻璃的热学和电学性能研究

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Mohd Shoab, Zubair Aslam, Nargis Fatima Khatoon, Shabeena Saifi, Javid Ali, Firoz Khan, Sultan Alomairy, Mohammad Zulfequar
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引用次数: 0

摘要

本文报道了熔融淬火法制备的多组分(Se85Te15)95SnxAly硫系玻璃的结构、热学和电学性能。从热学和电学表征得到的结果用于预测所制备玻璃的电相变行为,并讨论了Al和Sn掺入Se-Te玻璃中对于相变存储器件应用的意义。在升温速率为5、10、15和20 K/min时,用DSC对合金进行热分析,结果表明合金的特征温度(Tg、Tc、Tp和Tm)逐渐升高。然而,由于合金中金属杂质的加入,合金的特征温度降低,结晶活化能(Ec)值也随之降低。Avrami指数的估算值和XRD分析结果表明,(Se85Te15)和(Se85Te15)95Sn5合金仅在表面成核,而(Se85Te15)95Sn2.5Al2.5和(Se85Te15)95Al5合金则有体积生长。Al和Sn的加入提高了合金的交流和直流电导率,并使合金的介电参数ε′和ε′′逐渐增大。频率指数s的计算值及其随温度的变化表明可以使用相关势垒跳变模型来理解所制备合金的交流传导机理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of thermal and electrical properties of Sn and Al incorporated Se–Te chalcogenide glasses for phase change memory applications

In this work structural, thermal and electrical properties of multi-component (Se85Te15)95SnxAly chalcogenide glasses synthesized by melt quenching technique are reported. Results obtained from thermal and electrical characterizations are used to anticipate the electrical phase change behavior of prepared glasses and significance of Al and Sn incorporation in Se–Te glass for phase change memory device applications has been discussed. Thermal investigation of prepared alloys by DSC at heating rates of 5, 10, 15 and 20 K/min revealed a stepwise increase in characteristic temperatures (Tg, Tc, Tp and Tm). However, a decrease in characteristic temperature also accompanied by a decrease in the value of activation energy of crystallization (Ec) in response to addition of metallic impurities in the alloys has been witnessed. Estimated value of Avrami index and results revealed by XRD analysis suggests nucleation only at the surface of alloys Se85Te15 and (Se85Te15)95Sn5 while a volumetric crystal growth in (Se85Te15)95Sn2.5Al2.5 and (Se85Te15)95Al5 has been observed. Addition of Al and Sn resulted in the enhanced AC and DC conductivity of alloys and a stepwise increase in the values of dielectric parameters (εʹ and εʺ). The calculated value of frequency exponent “s” and its variation with temperature suggested the use of correlated barrier hopping model for understanding the AC conduction mechanism of prepared alloys.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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