硬件加速器的组合设计:数据流组件接口与Tydi-Chisel

IF 2.8 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Casper Cromjongh;Yongding Tian;H. Peter Hofstee;Zaid Al-Ars
{"title":"硬件加速器的组合设计:数据流组件接口与Tydi-Chisel","authors":"Casper Cromjongh;Yongding Tian;H. Peter Hofstee;Zaid Al-Ars","doi":"10.1109/TVLSI.2024.3461330","DOIUrl":null,"url":null,"abstract":"As dedicated hardware is becoming more prevalent in accelerating complex applications, methods are needed to enable easy integration of multiple hardware components into a single accelerator system. However, this vision of composable hardware is hindered by the lack of standards for interfaces that allow such components to communicate. To address this challenge, the Tydi standard was proposed to facilitate the representation of streaming data in digital circuits, notably providing interface specifications of composite and variable-length data structures. At the same time, constructing hardware in a Scala embedded language (Chisel) provides a suitable environment for deploying Tydi-centric components due to its abstraction level and customizability. This article introduces Tydi-Chisel, a library that integrates the Tydi standard within Chisel, along with a toolchain and methodology for designing data-streaming accelerators. This toolchain reduces the effort needed to design streaming hardware accelerators by raising the abstraction level for streams and module interfaces, hereby avoiding writing boilerplate code, and allows for easy integration of accelerator components from different designers. This is demonstrated through an example project incorporating various scenarios where the interface-related declaration is reduced by 6–14 times. Tydi-Chisel project repository is available at \n<uri>https://github.com/abs-tudelft/Tydi-Chisel</uri>\n.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 12","pages":"2281-2292"},"PeriodicalIF":2.8000,"publicationDate":"2024-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Hardware-Accelerator Design by Composition: Dataflow Component Interfaces With Tydi-Chisel\",\"authors\":\"Casper Cromjongh;Yongding Tian;H. Peter Hofstee;Zaid Al-Ars\",\"doi\":\"10.1109/TVLSI.2024.3461330\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As dedicated hardware is becoming more prevalent in accelerating complex applications, methods are needed to enable easy integration of multiple hardware components into a single accelerator system. However, this vision of composable hardware is hindered by the lack of standards for interfaces that allow such components to communicate. To address this challenge, the Tydi standard was proposed to facilitate the representation of streaming data in digital circuits, notably providing interface specifications of composite and variable-length data structures. At the same time, constructing hardware in a Scala embedded language (Chisel) provides a suitable environment for deploying Tydi-centric components due to its abstraction level and customizability. This article introduces Tydi-Chisel, a library that integrates the Tydi standard within Chisel, along with a toolchain and methodology for designing data-streaming accelerators. This toolchain reduces the effort needed to design streaming hardware accelerators by raising the abstraction level for streams and module interfaces, hereby avoiding writing boilerplate code, and allows for easy integration of accelerator components from different designers. This is demonstrated through an example project incorporating various scenarios where the interface-related declaration is reduced by 6–14 times. Tydi-Chisel project repository is available at \\n<uri>https://github.com/abs-tudelft/Tydi-Chisel</uri>\\n.\",\"PeriodicalId\":13425,\"journal\":{\"name\":\"IEEE Transactions on Very Large Scale Integration (VLSI) Systems\",\"volume\":\"32 12\",\"pages\":\"2281-2292\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Very Large Scale Integration (VLSI) Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10705101/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10705101/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0

摘要

由于专用硬件在加速复杂应用程序方面变得越来越普遍,因此需要能够将多个硬件组件轻松集成到单个加速器系统中的方法。然而,由于缺乏允许这些组件进行通信的接口标准,这种可组合硬件的愿景受到了阻碍。为了应对这一挑战,Tydi标准被提出,以促进数字电路中流数据的表示,特别是提供复合和变长数据结构的接口规范。同时,使用Scala嵌入式语言(Chisel)构建硬件,由于其抽象级别和可定制性,为部署以tydi为中心的组件提供了合适的环境。本文介绍了Tydi-Chisel,一个将Tydi标准集成到Chisel中的库,以及用于设计数据流加速器的工具链和方法。该工具链通过提高流和模块接口的抽象级别,减少了设计流硬件加速器所需的工作量,从而避免了编写样板代码,并允许来自不同设计人员的加速器组件轻松集成。通过一个包含各种场景的示例项目来演示这一点,其中与接口相关的声明减少了6-14倍。Tydi-Chisel项目存储库可在https://github.com/abs-tudelft/Tydi-Chisel获得。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hardware-Accelerator Design by Composition: Dataflow Component Interfaces With Tydi-Chisel
As dedicated hardware is becoming more prevalent in accelerating complex applications, methods are needed to enable easy integration of multiple hardware components into a single accelerator system. However, this vision of composable hardware is hindered by the lack of standards for interfaces that allow such components to communicate. To address this challenge, the Tydi standard was proposed to facilitate the representation of streaming data in digital circuits, notably providing interface specifications of composite and variable-length data structures. At the same time, constructing hardware in a Scala embedded language (Chisel) provides a suitable environment for deploying Tydi-centric components due to its abstraction level and customizability. This article introduces Tydi-Chisel, a library that integrates the Tydi standard within Chisel, along with a toolchain and methodology for designing data-streaming accelerators. This toolchain reduces the effort needed to design streaming hardware accelerators by raising the abstraction level for streams and module interfaces, hereby avoiding writing boilerplate code, and allows for easy integration of accelerator components from different designers. This is demonstrated through an example project incorporating various scenarios where the interface-related declaration is reduced by 6–14 times. Tydi-Chisel project repository is available at https://github.com/abs-tudelft/Tydi-Chisel .
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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