化学溶液沉积法外延生长掺钙LaRhO3薄膜

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Li Zhang, Chen Zhou, Renhuai Wei, Xuebin Zhu
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引用次数: 0

摘要

LaRhO3是一种典型的具有p型半导体性质的四维过渡金属钙钛矿氧化物。关于la位掺杂对LaRhO3薄膜性能影响的报道很少,而关于Ca掺杂对LaRhO3薄膜性能影响的研究还没有报道。首先采用化学溶液沉积法制备了La1-xCaxRhO3(0≤x≤0.2)薄膜。在单晶SrTiO3(001)衬底上成功制备了外延关系为LaRhO3(001)[110]||SrTiO3(001)[110]的外延La1-xCaxRhO3薄膜。Ca在La位点的固溶体极限小于0.3。研究了Ca掺杂对LRO薄膜微结构、电学和光学性能的影响。Ca的掺入降低了晶体的晶格常数、电阻率和光隙。该结果将为制备La1-xCaxRhO3基薄膜提供一条简单的途径,具有潜在的近红外透明导电薄膜的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Epitaxial growth of Ca-doped LaRhO3 thin films by chemical solution deposition

Epitaxial growth of Ca-doped LaRhO3 thin films by chemical solution deposition

LaRhO3 is a typical 4d transition metal perovskite oxide with p-type semiconductor-like properties. Few reports have been carried out about the La-site doping effects on the properties and no investigations have been carried out about Ca doping effects on LaRhO3 thin films. Here, La1-xCaxRhO3 (0 ≤ x ≤ 0.2) thin films were firstly deposited by chemical solution deposition. Epitaxial La1-xCaxRhO3 thin films on single crystal SrTiO3 (001) substrates with the epitaxial relationship of LaRhO3(001)[110]||SrTiO3(001)[110] have be successfully prepared. The solid solution limitation of Ca doping on La site is less than 0.3. The Ca doping effects on LRO thin film microstructures, electrical and optical properties were carefully investigated. With Ca doping, the lattice constant, the resistivity, and the optical gap were decreased. The results will provide a simple route to prepare La1-xCaxRhO3 based thin films for potential applications as near infrared transparent conducting thin films.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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