湿法蚀刻提高烧结熔融硅圆柱壳谐振器的性能

IF 2.2 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Yahya Atwa;Hamza Shakeel
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引用次数: 0

摘要

这封信介绍了使用可打印聚合物-玻璃混合物(Glassomer)和复制成型制造的圆柱壳谐振器(CSRs)的制造,表征和测试。我们首先制造了三个9.6 mm直径的熔融硅基csr,厚度为0.6 mm。在对全烧结玻璃器件进行湿法蚀刻后,每个谐振腔的壳体厚度减小到~ 0.3 mm。对于其中一个蚀刻器件,我们观察到质量因子提高了3到4倍,时间常数值增加了大约7倍,N = 2和N = 3共振模式的频率分裂降低了2到8倍。此外,表面粗糙度的增强(~ 340 ~ ~ 156 nm)和外壳厚度的减小与器件性能的改善直接相关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enhancing the Performance of Sintered Fused Silica Cylindrical Shell Resonators Through Wet Etching
This letter presents the fabrication, characterization, and testing of cylindrical shell resonators (CSRs) manufactured using a printable polymer–glass mixture (Glassomer) and replication molding. We first manufactured three 9.6-mm-diameter fused silica-based CSRs with a thickness of 0.6 mm. After performing wet etching of fully sintered glass devices, the shell thickness of each resonator was reduced to ∼0.3 mm. For one of the etched devices, we observed between three to four times improvements in quality factor, approximately seven times increase in time constant values, and two to eight times reduction in frequency split for N = 2 and N = 3 resonance modes. Moreover, the enhancement of surface roughness (∼340 to ∼156 nm) and reduction in shell thickness show a direct relationship with improvements in device performance.
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来源期刊
IEEE Sensors Letters
IEEE Sensors Letters Engineering-Electrical and Electronic Engineering
CiteScore
3.50
自引率
7.10%
发文量
194
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