单靠人工智能还不能为芯片设计做好准备:经典搜索和机器学习的结合可能是未来的发展方向

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Somdeb Majumdar;Uday Mallappa;Hesham Mostafa
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引用次数: 0

摘要

1971年,费德里科·费金(Federico Faggin)完成了第一个商用微处理器英特尔4004的草图,当时他只使用了直边和彩色铅笔。自那以来,芯片设计已经走过了漫长的道路。今天的设计人员拥有大量的软件工具来规划和测试新的集成电路。但随着芯片变得异常复杂——有些芯片包含数千亿个晶体管——设计师必须解决的问题也越来越多。而且这些工具并不总是能胜任这项任务。■现代芯片工程是一个由九个阶段组成的迭代过程,从系统规格到封装。每个阶段都有几个子阶段,每个子阶段可能需要几周到几个月的时间,这取决于问题的大小和约束条件。许多设计问题在10100到101000种可能性中只有少数可行的解决方案——这是大海捞针的情况。目前使用的自动化工具往往无法解决这种规模的现实问题,这意味着必须有人介入,这使得这个过程比芯片制造商所希望的更加费力和耗时。■毫不奇怪,人们对使用机器学习来加快芯片设计的兴趣越来越大。然而,正如我们在英特尔人工智能实验室的团队所发现的那样,机器学习算法本身往往是不够的,特别是在处理必须满足的多个约束时。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
AI Alone isn't Ready for Chip Design: A Combination of Classical Search and Machine Learning May be the Way Forward
CHIP DESIGN has come a long way since 1971, when Federico Faggin finished sketching the first commercial microprocessor, the Intel 4004, using little more than a straight-edge and colored pencils. Today's designers have a plethora of software tools at their disposal to plan and test new integrated circuits. But as chips have grown staggeringly complex—with some comprising hundreds of billions of transistors—so have the problems designers must solve. And those tools aren't always up to the task. ■ Modern chip engineering is an iterative process of nine stages, from system specification to packaging. Each stage has several substages, and each of those can take weeks to months, depending on the size of the problem and its constraints. Many design problems have only a handful of viable solutions out of 10 100 to 10 1000 possibilities—a needle-in-a-hay-stack scenario if ever there was one. Automation tools in use today often fail to solve real-world problems at this scale, which means that humans must step in, making the process more laborious and time-consuming than chipmakers would like. ■ Not surprisingly, there is a growing interest in using machine learning to speed up chip design. However, as our team at the Intel AI Lab has found, machine-learning algorithms are often insufficient on their own, particularly when dealing with multiple constraints that must be satisfied.
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来源期刊
IEEE Spectrum
IEEE Spectrum 工程技术-工程:电子与电气
CiteScore
2.50
自引率
0.00%
发文量
254
审稿时长
4-8 weeks
期刊介绍: IEEE Spectrum Magazine, the flagship publication of the IEEE, explores the development, applications and implications of new technologies. It anticipates trends in engineering, science, and technology, and provides a forum for understanding, discussion and leadership in these areas. IEEE Spectrum is the world''s leading engineering and scientific magazine. Read by over 300,000 engineers worldwide, Spectrum provides international coverage of all technical issues and advances in computers, communications, and electronics. Written in clear, concise language for the non-specialist, Spectrum''s high editorial standards and worldwide resources ensure technical accuracy and state-of-the-art relevance.
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