{"title":"利用光伏效应对有缺陷的微型led进行高速无触点检测","authors":"Toshiro Yasuda, Shigetoshi Sugawa, Yayoi Yokomichi, Kazuhisa Kobayashi, Hiroshi Hamori, Akinobu Teramoto","doi":"10.1002/jsid.2013","DOIUrl":null,"url":null,"abstract":"<p>The most significant challenge associated with micro-light-emitting-diode (micro-LED) displays, which are anticipated to be the next generation of display technology, is the high manufacturing cost. In order to reduce manufacturing costs, it is essential to improve yield. Improving the manufacturing yield of them necessitates the evaluation of micro-LED chips prior to their installation onto substrates. However, the microsize and large quantity of these chips renders inspection difficult with conventional inspection methods. Herein, we propose a method for inspecting micro-LED chips by measuring the voltage generated between the anode and cathode due to the photovoltaic effect using a developed proximity capacitance image sensor. As this inspection method does not require the use of probe pins to contact LED electrodes, it enables simultaneous inspection of multiple chips in a short time without causing any damage to the electrodes. In this paper, an experimental system equipped with this sensor was developed to demonstrate the basic measurement principle. Moreover, we demonstrated that more than 50,000 micro-LED chips with a size of 60 μm × 34 μm can be simultaneously inspected in approximately 2 s.</p>","PeriodicalId":49979,"journal":{"name":"Journal of the Society for Information Display","volume":"32 12","pages":"825-835"},"PeriodicalIF":1.7000,"publicationDate":"2024-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/jsid.2013","citationCount":"0","resultStr":"{\"title\":\"High-speed and contactless inspection of defective micro-LEDs through the photovoltaic effect\",\"authors\":\"Toshiro Yasuda, Shigetoshi Sugawa, Yayoi Yokomichi, Kazuhisa Kobayashi, Hiroshi Hamori, Akinobu Teramoto\",\"doi\":\"10.1002/jsid.2013\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>The most significant challenge associated with micro-light-emitting-diode (micro-LED) displays, which are anticipated to be the next generation of display technology, is the high manufacturing cost. In order to reduce manufacturing costs, it is essential to improve yield. Improving the manufacturing yield of them necessitates the evaluation of micro-LED chips prior to their installation onto substrates. However, the microsize and large quantity of these chips renders inspection difficult with conventional inspection methods. Herein, we propose a method for inspecting micro-LED chips by measuring the voltage generated between the anode and cathode due to the photovoltaic effect using a developed proximity capacitance image sensor. As this inspection method does not require the use of probe pins to contact LED electrodes, it enables simultaneous inspection of multiple chips in a short time without causing any damage to the electrodes. In this paper, an experimental system equipped with this sensor was developed to demonstrate the basic measurement principle. Moreover, we demonstrated that more than 50,000 micro-LED chips with a size of 60 μm × 34 μm can be simultaneously inspected in approximately 2 s.</p>\",\"PeriodicalId\":49979,\"journal\":{\"name\":\"Journal of the Society for Information Display\",\"volume\":\"32 12\",\"pages\":\"825-835\"},\"PeriodicalIF\":1.7000,\"publicationDate\":\"2024-11-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://onlinelibrary.wiley.com/doi/epdf/10.1002/jsid.2013\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of the Society for Information Display\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1002/jsid.2013\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of the Society for Information Display","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/jsid.2013","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
High-speed and contactless inspection of defective micro-LEDs through the photovoltaic effect
The most significant challenge associated with micro-light-emitting-diode (micro-LED) displays, which are anticipated to be the next generation of display technology, is the high manufacturing cost. In order to reduce manufacturing costs, it is essential to improve yield. Improving the manufacturing yield of them necessitates the evaluation of micro-LED chips prior to their installation onto substrates. However, the microsize and large quantity of these chips renders inspection difficult with conventional inspection methods. Herein, we propose a method for inspecting micro-LED chips by measuring the voltage generated between the anode and cathode due to the photovoltaic effect using a developed proximity capacitance image sensor. As this inspection method does not require the use of probe pins to contact LED electrodes, it enables simultaneous inspection of multiple chips in a short time without causing any damage to the electrodes. In this paper, an experimental system equipped with this sensor was developed to demonstrate the basic measurement principle. Moreover, we demonstrated that more than 50,000 micro-LED chips with a size of 60 μm × 34 μm can be simultaneously inspected in approximately 2 s.
期刊介绍:
The Journal of the Society for Information Display publishes original works dealing with the theory and practice of information display. Coverage includes materials, devices and systems; the underlying chemistry, physics, physiology and psychology; measurement techniques, manufacturing technologies; and all aspects of the interaction between equipment and its users. Review articles are also published in all of these areas. Occasional special issues or sections consist of collections of papers on specific topical areas or collections of full length papers based in part on oral or poster presentations given at SID sponsored conferences.