锰离子(Mn2+)掺杂诱导W18O49表面缺陷,实现水中环丙沙星的高效脱除

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yaqin Yang, Yu Gong, Zhongyu Li, Zhiying Liu, Min Shao
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引用次数: 0

摘要

缺陷工程作为提高催化剂性能的有效手段,不仅可以产生高效的催化活性位点,还可以提供电荷和能量传递通道。本研究采用溶剂热法合成了掺杂锰离子(Mn2+)的W18O49催化剂,以提高其在水中降解环丙沙星(CIP)的催化性能。在全光谱照明下,掺杂Mn2+的W18O49表现出显著的催化效率,在1小时内对CIP的降解率达到74%,是纯W18O49的1.8倍。纯W18O49和掺杂Mn2+的W18O49样品都进行了光催化降解领域常用的标准表征测试。根据测试结果可以推断,Mn2+掺杂通过诱导缺陷工程导致W18O49表面氧空位浓度增加,从而增强其光催化活性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Induction of W18O49 surface defects by manganese ion (Mn2+) doping to achieve efficient removal of ciprofloxacin in water

Defect engineering, as an effective means to improve catalyst performance, can not only generate efficient catalytic active sites but also provide charge and energy transfer channels. In this study, a manganese ion-doped (Mn2+) W18O49 catalyst was synthesized using a solvothermal method to enhance its catalytic performance for the degradation of ciprofloxacin (CIP) in water. Under full-spectrum illumination, the Mn2+-doped W18O49 exhibited significant catalytic efficiency, achieving a 74% degradation rate of CIP within one hour, which was 1.8 times that of pure W18O49. Both pure W18O49 and Mn2+-doped W18O49 samples have undergone standard characterization tests commonly used in the field of photocatalytic degradation. Based on the test results, it can be inferred that Mn2+ doping leads to an increase in the concentration of oxygen vacancies on the surface of W18O49 by inducing defect engineering, thereby enhancing its photocatalytic activity.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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