{"title":"考虑磨料磨损的光伏单晶硅金刚石线锯锯切力建模与分析","authors":"Yufeng Guo, Yufei Gao, Chunfeng Yang","doi":"10.1016/j.wear.2024.205669","DOIUrl":null,"url":null,"abstract":"<div><div>In the process of diamond wire sawing, the sawing force is produced by wire bow formed by the diamond wire. The wear of the diamond wire during sawing will decrease its ability of removing materials, thereby increasing the wire bow and the sawing force, affecting the quality of the as-sawn wafers and even increasing the risk of wire breakage. Therefore, in order to reduce the risk of wire breakage, it is of great significance to establish a sawing force model considering wear and realize the theoretical prediction and analysis of sawing force. In this paper, different forms of abrasives on the surface of the diamond wire are characterized, and the change of wear rate in sawing is analyzed. Combined with the material removal process, a sawing force model considering wear of the abrasives was founded, and the accuracy of the model was verified by sawing experiments. The sawing force of the wire web under multi-wire processing parameters in the industrial production of photovoltaic monocrystalline silicon wafers was analyzed using the established model. With the increase of wire speed from 1500 m/min to 2700 m/min, the peak value of wire web sawing force gradually decreases from 7.12N/m to 4.47 N/m. With the increase of feeding speed from 1.7 mm/min to 2.9 mm/min, the peak value of wire web sawing force gradually increases from 4.3 N/m to 6.55 N/m. The research results provide guiding significance for diamond wire sawing production.</div></div>","PeriodicalId":23970,"journal":{"name":"Wear","volume":"562 ","pages":"Article 205669"},"PeriodicalIF":5.3000,"publicationDate":"2024-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Sawing force modeling and analysis for diamond wire sawing PV monocrystalline silicon considering abrasive wear\",\"authors\":\"Yufeng Guo, Yufei Gao, Chunfeng Yang\",\"doi\":\"10.1016/j.wear.2024.205669\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>In the process of diamond wire sawing, the sawing force is produced by wire bow formed by the diamond wire. The wear of the diamond wire during sawing will decrease its ability of removing materials, thereby increasing the wire bow and the sawing force, affecting the quality of the as-sawn wafers and even increasing the risk of wire breakage. Therefore, in order to reduce the risk of wire breakage, it is of great significance to establish a sawing force model considering wear and realize the theoretical prediction and analysis of sawing force. In this paper, different forms of abrasives on the surface of the diamond wire are characterized, and the change of wear rate in sawing is analyzed. Combined with the material removal process, a sawing force model considering wear of the abrasives was founded, and the accuracy of the model was verified by sawing experiments. The sawing force of the wire web under multi-wire processing parameters in the industrial production of photovoltaic monocrystalline silicon wafers was analyzed using the established model. With the increase of wire speed from 1500 m/min to 2700 m/min, the peak value of wire web sawing force gradually decreases from 7.12N/m to 4.47 N/m. With the increase of feeding speed from 1.7 mm/min to 2.9 mm/min, the peak value of wire web sawing force gradually increases from 4.3 N/m to 6.55 N/m. The research results provide guiding significance for diamond wire sawing production.</div></div>\",\"PeriodicalId\":23970,\"journal\":{\"name\":\"Wear\",\"volume\":\"562 \",\"pages\":\"Article 205669\"},\"PeriodicalIF\":5.3000,\"publicationDate\":\"2024-11-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Wear\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0043164824004344\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Wear","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0043164824004344","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Sawing force modeling and analysis for diamond wire sawing PV monocrystalline silicon considering abrasive wear
In the process of diamond wire sawing, the sawing force is produced by wire bow formed by the diamond wire. The wear of the diamond wire during sawing will decrease its ability of removing materials, thereby increasing the wire bow and the sawing force, affecting the quality of the as-sawn wafers and even increasing the risk of wire breakage. Therefore, in order to reduce the risk of wire breakage, it is of great significance to establish a sawing force model considering wear and realize the theoretical prediction and analysis of sawing force. In this paper, different forms of abrasives on the surface of the diamond wire are characterized, and the change of wear rate in sawing is analyzed. Combined with the material removal process, a sawing force model considering wear of the abrasives was founded, and the accuracy of the model was verified by sawing experiments. The sawing force of the wire web under multi-wire processing parameters in the industrial production of photovoltaic monocrystalline silicon wafers was analyzed using the established model. With the increase of wire speed from 1500 m/min to 2700 m/min, the peak value of wire web sawing force gradually decreases from 7.12N/m to 4.47 N/m. With the increase of feeding speed from 1.7 mm/min to 2.9 mm/min, the peak value of wire web sawing force gradually increases from 4.3 N/m to 6.55 N/m. The research results provide guiding significance for diamond wire sawing production.
期刊介绍:
Wear journal is dedicated to the advancement of basic and applied knowledge concerning the nature of wear of materials. Broadly, topics of interest range from development of fundamental understanding of the mechanisms of wear to innovative solutions to practical engineering problems. Authors of experimental studies are expected to comment on the repeatability of the data, and whenever possible, conduct multiple measurements under similar testing conditions. Further, Wear embraces the highest standards of professional ethics, and the detection of matching content, either in written or graphical form, from other publications by the current authors or by others, may result in rejection.