用于等离子喷涂的 YSZ 陶瓷基底的高速激光制图:YSZ 涂层的微观结构操控和附着力

IF 3.2 3区 材料科学 Q2 MATERIALS SCIENCE, COATINGS & FILMS
Radek Musalek, Tomas Tesar, Jakub Minarik, Jiri Matejicek, Frantisek Lukac, Ole Peters, Sebastian Kraft, Udo Loeschner, Joerg Schille, Jonas Dudik, Jiri Martan
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引用次数: 0

摘要

本文介绍了使用最近开发的高功率激光对陶瓷基底进行高速表面周期性结构/图案化的新可能性,以便随后进行热喷涂涂层沉积。钇稳定氧化锆(YSZ)被选为基底和涂层的模型陶瓷。使用三种不同的激光技术制作了三种不同类型的图案:标称深度为 15 和 30 微米的凹陷(脉冲纳秒激光)、标称深度为 15 和 30 微米的网格(连续波激光)以及标称深度为 30 微米的柱状(超短脉冲飞秒激光)。所有表面图案都是完全周期性的,表面粗糙度从 Sa = 4.5 微米到 10.3 微米不等,大大超过了传统的喷砂工艺。脉冲激光和连续波激光显示出极高的加工速率(分别高达 54.5 mm2/s 和 323.6 mm2/s),并有形成浅表面裂纹网的趋势。超短脉冲激光技术速度较慢(处理速度为 1.65 mm2/s),但表面无裂纹,并有理想的微型锚点。使用粉末、溶液和悬浮原料进行等离子喷涂,提供了一个实验矩阵,展示了每种图案-原料组合的潜在优势和风险。并非所有组合都能成功沉积涂层,但结果表明,涂层的微观结构可以通过激光纹理刻意控制,特别是在悬浮喷涂的情况下,周期性的基底图案会导致周期性的涂层微观结构。此外,在许多情况下,涂层与基底的附着力/粘合力也可以通过激光对基底进行图案化而得到显著改善。从溶液中沉积到柱形图案上的涂层附着力/粘合力强度最高(26.2 ± 4.8 兆帕)。最后,还展示了将连续波激光和飞秒激光分别产生的高速和先进表面形态与等离子喷涂涂层的直接图案化相结合的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

High-Speed Laser Patterning of YSZ Ceramic Substrates for Plasma Spraying: Microstructure Manipulation and Adhesion of YSZ Coatings

High-Speed Laser Patterning of YSZ Ceramic Substrates for Plasma Spraying: Microstructure Manipulation and Adhesion of YSZ Coatings

This paper introduces novel possibilities of using recently developed high-power lasers for high-speed surface periodic structuring/patterning of the ceramic substrates for the subsequent thermal spray coating deposition, which may be difficult to pattern using conventional methods. Yttria-stabilized zirconia (YSZ) was selected as model ceramic for both substrates and coating. Three different types of patterns were produced by three different laser technologies: dimples with nominal depth of 15 and 30 µm (pulsed nanosecond laser), grids with nominal depth of 15 and 30 µm (continuous wave laser), and pillars with nominal depth 30 µm (ultrashort pulsed femtosecond laser). All surface patterns were thoroughly periodical and their surface roughness ranged from S= 4.5 to 10.3 µm, significantly surpassing conventional grit-blasting. Pulsed and continuous wave lasers showed very high process rates (up to 54.5 mm2/s and 323.6 mm2/s, respectively) and tendency to develop network of shallow surface cracks. Ultrashort pulsed laser technology was slower (process rate 1.65 mm2/s) but the surface was crack-free with desirable miniature anchoring points. Plasma spraying was carried out with powder, solution, and suspension feedstocks providing an experimental matrix demonstrating potential benefits and risks of each pattern-feedstock combination. Not all combinations led to successful coating deposition, but results show that microstructure of the coating may be deliberately controlled by laser texturing, in particular periodic substrate pattern led to periodic coating microstructure in the case of suspension spraying. Also adhesion/cohesion of the coating to the substrate may be in many cases significantly improved by laser patterning of the substrate. The highest coating adhesion/cohesion strength (26.2 ± 4.8 MPa) was achieved for the coating deposited from solution on pillar patterns. Finally, a possibility to combine the high-speed and advanced surface morphology produced by continuous wave and femtosecond lasers, respectively, and direct patterning of plasma sprayed coating were also demonstrated.

Graphical Abstract

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来源期刊
Journal of Thermal Spray Technology
Journal of Thermal Spray Technology 工程技术-材料科学:膜
CiteScore
5.20
自引率
25.80%
发文量
198
审稿时长
2.6 months
期刊介绍: From the scientific to the practical, stay on top of advances in this fast-growing coating technology with ASM International''s Journal of Thermal Spray Technology. Critically reviewed scientific papers and engineering articles combine the best of new research with the latest applications and problem solving. A service of the ASM Thermal Spray Society (TSS), the Journal of Thermal Spray Technology covers all fundamental and practical aspects of thermal spray science, including processes, feedstock manufacture, and testing and characterization. The journal contains worldwide coverage of the latest research, products, equipment and process developments, and includes technical note case studies from real-time applications and in-depth topical reviews.
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