用于电子应用的电沉积镍铁合金薄膜:结构和磁性能

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
A. Kotelnikova, K. Kadyrzhanov, V. Fedkin, D. Shlimas, T. Zubar, Daryn Borgekov, Maxim Zdorovets, Alex Trukhanov
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引用次数: 0

摘要

采用脉冲和脉冲反向电流模式电沉积镍铁纳米结构薄膜。观察到了模式、化学成分、结构特征和磁性能之间的相关性。在从脉冲电沉积模式过渡到脉冲电流电沉积模式(从 42.1% 到 27.5%)和反向脉冲延长(从 27.5% 到 17.4%)时,都观察到铁含量降低。这为通过改变电沉积模式来控制过合金薄膜中宽区域的铁/镍比例开辟了广阔的前景。XRD 数据显示,所有薄膜中都形成了铁在镍中的固溶体。所有样品均为单相。与脉冲样品相比,脉冲反向样品的表面更粗糙(Rq 为 14.1 至 36.5 nm),晶粒凸起,而脉冲样品的表面更光滑(Rq 为 4.1 nm),晶粒难以区分。随着脉冲持续时间的反向增加,观察到晶粒尺寸均匀度更高。所有镍铁合金薄膜都具有明显的磁各向异性,这是从磁滞回线(平面内和平面外测量)中观察到的。所有样品的易磁化轴都位于薄膜平面内。镍铁合金薄膜的矫顽力 Hc 在样品平面内测量时比在样品平面外测量时大 2-12 倍。这证实了通过改变电沉积模式获得高各向异性纳米结构薄膜的可能性。这种薄膜可成功应用于磁场传感器和电磁屏蔽。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrodeposited NiFe films for electronic applications: structure and magnetic properties

Pulse and pulse-reverse current modes were used to electrodeposit Ni–Fe nanostructured films. Correlation between modes, chemical composition, structural features, and magnetic properties was observed. Iron content decrease was observed both with transition from pulse to pulse current electrodeposition mode (from 42.1 to 27.5 at.%) and with reverse pulse prolongation (from 27.5 to 17.4 at.%). It opens broad perspectives for control of the Fe/Ni ratio in wide region in permalloy films by the varying of the electrodeposition regimes. XRD data showed that Fe solid solution in Ni was formed in all the films. All samples were single phase. Pulse-reverse samples have rougher surface (Rq from 14.1 to 36.5 nm) with convex grains in comparison with pulse sample, which has smoother surface (Rq of 4.1 nm) and undistinguishable grains. Higher grain size uniformity with reverse pulse duration increase was observed. All the Ni–Fe films have a significant magnetic anisotropy observed from the hysteresis loops, measured in plane and out of plane. The easy magnetization axis is located in the plane of the film for all the samples. Coercive force Hc of the Ni–Fe films is ∼ 2–12 times greater during the sample in-plane investigations in comparison with sample out-of-plane investigations. This confirms possibility to obtain the highly anisotropy nanostructured film by varying the electrodeposition regimes. Such kind of films can be successfully applied for magnetic field sensors and for electromagnetic shields.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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