金纳米颗粒锚定胺功能化镍金属有机框架复合材料,用于太阳光辅助高效降解玫瑰红染料和还原 Cr(VI)

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
K. V. Kavya, Dhanaprabhu Pattappan, Raju Suresh Kumar, Sivalingam Ramesh, Kavitha Thangavelu, R. T. Rajendra Kumar, Yuvaraj Haldorai
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引用次数: 0

摘要

本报告利用胺功能化镍金属有机框架(Ni-MOF)和金(Au)组成的复合材料,在太阳光下进行了玫瑰红染料(RB)的光降解和六价铬的还原。形态学研究表明,Ni-MOF 表面缀有平均尺寸小于 10 纳米的金纳米颗粒。该复合光催化剂对六价铬的还原效率为 82%,对 RB 染料的降解效率为 88%。自由基清除实验证实,超氧自由基的产生是 RB 降解的主要原因。循环稳定性测试表明,RB 的降解效率在连续七个循环后没有明显下降。这些结果凸显了 Ni-MOF/Au 复合材料良好的光催化特性,表明其在环境修复中的潜在用途。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Gold nanoparticles anchored amine-functionalized nickel metal–organic framework composite for efficient solar light-assisted degradation of rose bengal dye and Cr(VI) reduction

In this report, the photodegradation of rose bengal dye (RB) and reduction of Cr(VI) was performed under solar light using a composite composed of amine-functionalized nickel metal–organic framework (Ni-MOF) and gold (Au). The morphological study revealed that the Ni-MOF surface was embellished with Au nanoparticles that had a mean size of less than 10 nm. The composite photocatalyst exhibited a reduction efficiency of 82% for Cr(VI) and degradation of 88% for RB dye. An experiment investigating radical scavenging confirmed that the production of superoxide radicals was the primary cause of the degradation of RB. The cyclic stability test revealed that the degrading efficiency of RB did not see a significant decline after seven consecutive cycles. The results highlight the favorable photocatalytic characteristics of the Ni-MOF/Au composite, indicating its potential use in environmental remediation.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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