近场等效无穷小偶极子模型的形态学搜索

IF 2 3区计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-11-25 DOI:10.1109/TEMC.2024.3492701

Tomas Monopoli;Xinglong Wu;Cheng Yang;Christian Schuster;Sergio Amedeo Pignari;Johannes Wolf;Flavia Grassi

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引用次数: 0

摘要

近场建模技术已被证明是非常有用的电磁兼容性评估。本文提出了一种利用近场无相扫描建立无限小偶极子模型的新方法。该方法通过将极小偶极子的模式与实测场图进行比较，可以识别出最佳的偶极子源位置。最后，利用Levenberg-Marquardt算法对偶极矩进行拟合。该方法在两个不同的虚拟设备上进行了验证，并在真实设备上进行了测量。这些测试用例涵盖了频率范围（156、381、514和1ghz）和扫描尺寸范围（9.4 cm × 8.4 cm和10.6 cm × 14 cm），证明了所提出方法的鲁棒性和通用性。

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Morphological Search for Near-Field Equivalent Infinitesimal Dipole Models

Near-field modeling techniques have proven to be very useful for electromagnetic compatibility evaluation. In this article, a new method for building infinitesimal dipole models using near-field phaseless scans is presented. The proposed approach enables the identification of optimal dipole source locations by comparing the pattern of an infinitesimal dipole with the measured field maps. Finally, the dipole moments are fitted by using the Levenberg–Marquardt algorithm. This method is validated on two different virtual devices and on measurements from a real device. These test cases cover a range of frequencies (156, 381, 514, and 1 GHz) and scan dimensions (9.4 cm × 8.4 cm and 10.6 cm × 14 cm), demonstrating the robustness and versatility of the proposed method.

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来源期刊

IEEE Transactions on Electromagnetic Compatibility 工程技术-电信学

CiteScore

4.80

自引率

19.00%

发文量

235

审稿时长

2.3 months

期刊介绍： IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.