高热导率和高热焓多层柔性相变材料的制备与应用

IF 6.3 2区材料科学 Q1 MATERIALS SCIENCE, COMPOSITES

Composite Structures Pub Date : 2024-11-22 DOI:10.1016/j.compstruct.2024.118718

Jianjuan Yuan , Yuyao Yan , Xiangfei Kong , Chendong Wang , Man Fan

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引用次数: 0

摘要

相变材料（PCM）利用潜热储存热量，被广泛应用于电子元件的热管理。然而，赋予 PCM 高导热性和高热焓仍然是一项挑战。本研究设计了一种多层结构，通过熔融共混制备了石蜡（PA）/苯乙烯-b-（乙烯-共丁烯）-b-苯乙烯三嵌段共聚物（SEBS）（PA/SEBS）和 PA/SEBS/膨胀石墨（EG）（PA/SEBS/EG），并依次交联在一起，命名为 0EG@6EG。结果表明，0EG@6EG 的焓值高达 167.46 kJ-kg-1，与传统的均匀结构相比，热导率有所提高。0EG@6EG 具有一定的自愈能力，层间接触面可承受 0.23 兆帕的拉伸强度。被动实验表明，0EG@6EG 的升温速率比 PA/SEBS/3EG 高 4.08%。主动实验表明，0EG@6EG 与 PA/SEBS/3EG 的最高出口温差为 1.52 °C，释放的热量比 PA/SEBS/3EG 高 26.73 %。0EG@6EG 中 PA/SEBS/0EG 与 PA/SEBS/6EG 的最佳厚度比为 1.2:0.8，当活性系统与 PA/SEBS/6EG 层接触时，有利于增强热传递。这项工作为在不降低焓值的情况下提高 PCM 的热导率提供了参考。

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Preparation and application of multilayered flexible phase change material with high thermal conductivity and high enthalpy

Phase change material (PCM) uses latent heat to store heat and are widely used in thermal management of electronic components. However, endowing PCM with high thermal conductivity and high enthalpy remains a challenge. This study designs a multilayered structure, paraffin (PA)/styrene-b-(ethylene-co-butylene)-b-styrene triblock copolymer (SEBS) (PA/SEBS) and PA/SEBS/expanded graphite (EG) (PA/SEBS/EG) are prepared by melt blending and crosslinked together in sequence, named 0EG@6EG. The results show that the enthalpy value of 0EG@6EG is as high as 167.46 kJ·kg⁻¹, and the thermal conductivity has been improved compared to traditional uniform structure. 0EG@6EG has a certain degree of self-healing ability, and the contact surface between layers could withstand a tensile strength of 0.23 MPa. The passive experiment indicates that the temperature rising rate of 0EG@6EG is 4.08 % higher than that of PA/SEBS/3EG. The active experiment shows that the highest outlet temperature difference between 0EG@6EG and PA/SEBS/3EG is 1.52 °C, and the heat released is 26.73 % higher than that of PA/SEBS/3EG. The optimal thickness ratio between PA/SEBS/0EG to PA/SEBS/6EG in 0EG@6EG is 1.2:0.8, and when the active system contacts with the layer of PA/SEBS/6EG, it is conducive to enhance heat transfer. This work provides a reference for increasing the thermal conductivity of PCM without decreasing enthalpy value.

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来源期刊

Composite Structures 工程技术-材料科学：复合

CiteScore

12.00

自引率

12.70%

发文量

1246

审稿时长

78 days

期刊介绍： The past few decades have seen outstanding advances in the use of composite materials in structural applications. There can be little doubt that, within engineering circles, composites have revolutionised traditional design concepts and made possible an unparalleled range of new and exciting possibilities as viable materials for construction. Composite Structures, an International Journal, disseminates knowledge between users, manufacturers, designers and researchers involved in structures or structural components manufactured using composite materials. The journal publishes papers which contribute to knowledge in the use of composite materials in engineering structures. Papers deal with design, research and development studies, experimental investigations, theoretical analysis and fabrication techniques relevant to the application of composites in load-bearing components for assemblies, ranging from individual components such as plates and shells to complete composite structures.