Visual boiling experimental research based on lateral liquid supply structure

The high heat transfer coefficient and critical heat flux density of thin liquid film boiling provide new ideas for enhancing boiling heat transfer, but the bottom-up liquid supply method limits its further application and development. This study is based on the experimental research results of previous researchers and adds lateral liquid supply while maintaining a lower liquid level. And thin liquid film boiling experiments were conducted on the surface of silicon under low subcooling conditions (subcooling degree: 5 K). The obtained curves were compared with the results of smooth copper surface in pool boiling experiments. Among them, thin liquid film boiling exhibits excellent HTC and higher CHF (12.26 W/cm²·K and 191.63 W/cm², respectively). Then, the bubble behavior and flow characteristics of thin liquid film boiling bubbles were visualized and the heat transfer mechanism was analyzed. The experimental results indicate that the lateral liquid supply boiling structure designed in this study has great potential for application.