带有 AMF 和 TMF 触点的单个 VI 和串联 VI 的直流电压预触发特性

IF 3.8 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Vacuum Pub Date : 2024-11-16 DOI:10.1016/j.vacuum.2024.113840

Yun Geng , Xiaofei Yao , Siyi Wei , Jianning Yin , Jiangang Ding , Haomin Li , Yingsan Geng , Zhiyuan Liu

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引用次数: 0

摘要

双断口真空断路器（VCB）有效解决了单断口真空断路器的电压饱和问题，提高了真空断路器的性能。然而，目前对由不同触头结构组成的组合式串联真空灭弧室（VI）在直流电压下合闸时的预分闸特性还缺乏研究。本文通过实验和数值计算研究了单个真空灭弧室和具有杯式轴向磁场（AMF）触头和螺旋式横向磁场（TMF）触头的组合串联真空灭弧室的预触发特性。预启动特性包括 50% 预启动间隙 (d50)、预启动间隙分散 (σpre)、预启动电压 (Uf) 和预启动场强 (E)。两个单VI和四个系列VI分别为AMF单VI、TMF单VI、AMF-AMF系列VI、AMF-TMF系列VI、TMF-AMF系列VI和TMF-TMF系列VI。这项研究可为相控合闸中应用的串联变流器的设计提供依据，并为进一步分析电容开关下串联变流器的预启动特性提供理论支持。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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DC voltage prestrike characteristics of single VI and series VIs with AMF and TMF contacts

The double-break vacuum circuit breaker (VCB) effectively solves the problem of voltage saturation of the single-break VCB and improves the performance of the VCB. However, there is currently a lack of research on the prestrike characteristics of combined series vacuum interrupters (VIs) composed of different contact structures when closing under DC voltage. In this paper, the prestrike characteristics of a single VI and a combined series VIs with a cup-type axial magnetic field (AMF) contact and a spiral-type transverse magnetic field (TMF) contact are studied experimentally and numerically. The prestrike characteristics include 50 % prestrike gap (d₅₀), prestrike gap dispersion (σ_pre), prestrike voltage (U_f) and prestrike field strength (E). Two single VIs and four series VIs are AMF single VI, TMF single VI, AMF-AMF series VIs, AMF-TMF series VIs, TMF-AMF series VIs and TMF-TMF series VIs. This research can provide a basis for the design of the series VIs applied in the phase-controlled closing, and provide theoretical support for further analysis of the prestrike characteristics of the series VIs under capacitive switching.

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来源期刊

Vacuum 工程技术-材料科学：综合

CiteScore

6.80

自引率

17.50%

发文量

审稿时长

34 days

期刊介绍： Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.