气体保护对 2195-T8 Al-Li 合金钨极惰性气体焊接接头气孔分布和机械性能的影响

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2024-11-26 DOI:10.1016/j.matlet.2024.137769

Sicong Zhang , Yue Zhao , Quan Li , Zhandong Wan , Aiping Wu

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引用次数: 0

摘要

本研究采用钨极惰性气体（TIG）焊接法焊接了 2195-T8 Al-Li 合金接头，并采用了三种不同的气体保护策略。通过计算机断层扫描（CT）对焊点的气孔分布进行了量化，并对焊点的拉伸性能进行了评估。结果表明，采用适当的背面气体保护后，接头的平均极限拉伸强度和伸长率分别达到 396 兆帕和 5.0%，与未采用背面气体保护的接头相比，分别提高了 9.6% 和 47.1%。背面气体保护可有效减少焊缝根部的气孔，从而防止在拉伸试验中从此处产生裂纹。

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Influence of gas protection on porosity distribution and mechanical properties of 2195-T8 Al-Li alloy tungsten inert gas welded joints

In this study, 2195-T8 Al-Li alloy joints were welded by tungsten inert gas (TIG) welding with three different gas protection strategies. The porosity distribution of the joints was quantified by Computed tomography (CT), and the tensile properties of the joints were evaluated. The results indicate that with appropriate back gas protection, the average ultimate tensile strength and elongation of the joints reach 396 MPa and 5.0 %, respectively, increased by 9.6 % and 47.1 % compared to the joints without back gas protection. Back gas protection effectively reduces porosity at the weld root, thereby preventing crack initiation from here during the tensile test.

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive