Dynamic behaviors of interfacial oxides and elements during the ultrasonic-assisted diffusion bonding of 6063Al alloys

Efficiently breaking the oxide layer and rapidly diffusing of elements at low-temperature has been a longstanding goal in the diffusion bonding (DB) of Al alloys. To break the interfacial oxide layers and accelerate atomic diffusion, ultrasound energy was introduced during the DB of 6063Al. A full Zn–Al eutectoid joint was manufactured via a pure Zn interlayer at 360 °C in atmospheric by an ultrasonic-assisted diffusion bonding (U-DB) at only an ultrasonic vibration of10 min. During U-DB, brittle cracks were formed in the interfacial oxide layers due to high strain rate induced by ultrasonic action. Zn diffused into Al alloy through the brittle cracks in oxide layers via “subcutaneous diffusion,” forming a Zn–Al eutectoid diffusion region between the Al alloy and oxide layer. The oxide fragments irregularly migrated to the center of the joint due to Kirkendall effect and ultrasonic action, finally dispersed in the bonded metal. The bonded metal finally transformed as a full Zn–Al eutectoid phase after consuming interlayer. The shear strength of the Zn–Al eutectoid joint reached 82.6 MPa. The Zn–Al mutual diffusion coefficient of U-DB at 360 °C was ∼0.6 μm²/s, which was about 20 times higher than the thermal diffusion coefficient under same temperature condition. Additionally, the mechanism of ultrasonic-assisted diffusion based on the strain-driven diffusion mode was discussed in detail.