对 BN 进行表面接枝改性可显著提高环氧树脂的热导率

IF 5.1 2区材料科学 Q1 MATERIALS SCIENCE, CERAMICS

Ceramics International Pub Date : 2024-10-01 DOI:10.1016/j.ceramint.2024.09.398

Lu Wu, Guozhi Jia

{"title":"对 BN 进行表面接枝改性可显著提高环氧树脂的热导率","authors":"Lu Wu, Guozhi Jia","doi":"10.1016/j.ceramint.2024.09.398","DOIUrl":null,"url":null,"abstract":"<div><div>Boron nitride, as an excellent thermal conductive filler, has received widespread attention in the field of heat dissipation, and its interface thermal transport with organic matrix is a key issue for improving thermal conductivity. In this study, several typical modifiers are selected to modify boron nitride to improve its interfacial compatibility with epoxy resin. The composition of functional groups, crystal structure and factors affecting thermal conductivity of the modified boron nitride surface are systematically studied. The influence of main factors such as the structural characteristics of grafted molecules and the grafting functional groups on the construction of thermal conductivity channels was analyzed in detail. The results show that shorter chain length and fewer cross-linked branches are more conducive to phonon transport and propagation. The thermal conductivity of BN-KH570/EP composite at 26 wt% load reaches 1.52 W/m·K, which is 7.6 times that of pure epoxy resin. It also maintains good thermal stability at 600 °C, which provides a new idea for improving the interface interaction of boron nitride composites.</div></div>","PeriodicalId":267,"journal":{"name":"Ceramics International","volume":"50 23","pages":"Pages 50526-50534"},"PeriodicalIF":5.1000,"publicationDate":"2024-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Surface grafting modification of BN significantly enhanced the thermal conductivity for epoxy resin\",\"authors\":\"Lu Wu, Guozhi Jia\",\"doi\":\"10.1016/j.ceramint.2024.09.398\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Boron nitride, as an excellent thermal conductive filler, has received widespread attention in the field of heat dissipation, and its interface thermal transport with organic matrix is a key issue for improving thermal conductivity. In this study, several typical modifiers are selected to modify boron nitride to improve its interfacial compatibility with epoxy resin. The composition of functional groups, crystal structure and factors affecting thermal conductivity of the modified boron nitride surface are systematically studied. The influence of main factors such as the structural characteristics of grafted molecules and the grafting functional groups on the construction of thermal conductivity channels was analyzed in detail. The results show that shorter chain length and fewer cross-linked branches are more conducive to phonon transport and propagation. The thermal conductivity of BN-KH570/EP composite at 26 wt% load reaches 1.52 W/m·K, which is 7.6 times that of pure epoxy resin. It also maintains good thermal stability at 600 °C, which provides a new idea for improving the interface interaction of boron nitride composites.</div></div>\",\"PeriodicalId\":267,\"journal\":{\"name\":\"Ceramics International\",\"volume\":\"50 23\",\"pages\":\"Pages 50526-50534\"},\"PeriodicalIF\":5.1000,\"publicationDate\":\"2024-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Ceramics International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S027288422404433X\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CERAMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ceramics International","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S027288422404433X","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}

引用次数: 0

摘要

氮化硼作为一种优良的导热填料，在散热领域受到广泛关注，其与有机基体的界面热传输是提高导热性的关键问题。本研究选择了几种典型的改性剂对氮化硼进行改性，以改善其与环氧树脂的界面相容性。系统研究了官能团的组成、晶体结构以及影响改性氮化硼表面导热性的因素。详细分析了接枝分子的结构特征和接枝官能团等主要因素对导热通道构建的影响。结果表明，较短的链长和较少的交联分支更有利于声子的传输和传播。BN-KH570/EP 复合材料在 26 wt% 负载下的导热系数达到 1.52 W/m-K，是纯环氧树脂的 7.6 倍。它还能在 600 °C 下保持良好的热稳定性，这为改善氮化硼复合材料的界面相互作用提供了新思路。

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Surface grafting modification of BN significantly enhanced the thermal conductivity for epoxy resin

Boron nitride, as an excellent thermal conductive filler, has received widespread attention in the field of heat dissipation, and its interface thermal transport with organic matrix is a key issue for improving thermal conductivity. In this study, several typical modifiers are selected to modify boron nitride to improve its interfacial compatibility with epoxy resin. The composition of functional groups, crystal structure and factors affecting thermal conductivity of the modified boron nitride surface are systematically studied. The influence of main factors such as the structural characteristics of grafted molecules and the grafting functional groups on the construction of thermal conductivity channels was analyzed in detail. The results show that shorter chain length and fewer cross-linked branches are more conducive to phonon transport and propagation. The thermal conductivity of BN-KH570/EP composite at 26 wt% load reaches 1.52 W/m·K, which is 7.6 times that of pure epoxy resin. It also maintains good thermal stability at 600 °C, which provides a new idea for improving the interface interaction of boron nitride composites.

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来源期刊

Ceramics International 工程技术-材料科学：硅酸盐

CiteScore

9.40

自引率

15.40%

发文量

4558

审稿时长

25 days

期刊介绍： Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties. Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour. Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.