分流微通道流量不均匀性研究与锥形分流入口结构设计

IF 2.6 3区 工程技术 Q2 ENGINEERING, MECHANICAL
Yuan-Sheng Lin , Kai Chen , Han-Bing Ke , Yong-Hui Xie
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引用次数: 0

摘要

有效冷却集成控制系统中的电子设备至关重要。歧管微通道(MMC)液体冷却技术有很多优点,但冷却剂的不均匀分布限制了它的传热性能。本研究通过数值模拟分析了 MMC 散热器的不均匀性。研究提出了一种锥形歧管入口结构,以改善流动的均匀性。此外,由于数值模拟的计算量很大,因此提出了一种基于降阶模型的 MMC 散热器温度预测方法。结果表明,锥形分流板入口结构可以改善流动均匀性,而且随着锥角的增大,改善效果更加明显。减阶模型的平均相对误差(RE)和平均最大绝对误差(MAE)分别为 0.00406 % 和 0.78 K,表明减阶模型可以快速准确地预测 MMC 散热器的温度分布。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study on flow non-uniformity and design of tapered manifold inlet structure of manifold microchannels
Effective cooling of electronic equipment in the integrated control system is critical. Manifold microchannel (MMC) liquid cooling technology has many advantages, but the non-uniform distribution of coolant limits its heat transfer performance. This study analyzed the non-uniformity of MMC heat sinks through numerical simulations. A tapered manifold inlet structure was proposed to improve flow uniformity. Additionally, since numerical simulations are computationally intensive, a temperature prediction method for MMC heat sink based on a reduced-order model was proposed. The results show that the tapered manifold inlet structure can improve the flow uniformity, and the improvement is more obvious with the increase of the taper angle. The average relative error (RE) and the average maximum absolute error (MAE) of the reduced-order model are 0.00406 % and 0.78 K respectively, which indicates that the reduced-order model can predict the temperature distribution of MMC heat sink quickly and accurately.
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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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