通过层界面散射改善 β-Cu2+xSe/CuInSe2 多层薄膜的热电性能

IF 2.4 4区 物理与天体物理 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Yu Chen, Guihong Song, Zhihao Ben, Yusheng Wu, Junhua You
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引用次数: 0

摘要

制备并研究了不同调制周期的β-Cu2+xSe/CuInSe2多层薄膜。结果表明,沉积的薄膜具有明显的层状结构。随着调制周期的缩短,β-Cu2+xSe/CuInSe2 多层薄膜的室温载流子浓度、迁移率、电导率和热导率均有所下降,但塞贝克系数、功率因数和相对热电功勋值均有所上升。载流子浓度和迁移率的线性降低以及热导率随调制周期的降低分别归因于层界面和晶界对载流子和声子的散射。调制周期最小(160 nm)的样品在室温下具有最高的功率因数 ∼ 0.74,在 405 °C 时为 ∼ 1.56 mW m-1 K-2。在薄膜中插入异质层是提高塞贝克系数和降低热导率的有效方法,从而提高了薄膜的热电特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Improved thermoelectric properties of the β-Cu2+xSe/CuInSe2 multilayer films by layer interface scattering

Improved thermoelectric properties of the β-Cu2+xSe/CuInSe2 multilayer films by layer interface scattering
The β-Cu2+xSe/CuInSe2 multilayer films with different modulation period were prepared and studied. The results showed that the deposited films possessed obvious layered structure. The room temperature carrier concentration, mobility, electrical conductivity and thermal conductivity decreased, but the Seebeck coefficient and power factor and relative thermoelectric figure of merit increased with reducing modulation period of deposited β-Cu2-xSe/CuInSe2 multilayer films. The linear reduction of carrier concentration and mobility and the decrease in thermal conductivity with modulation period was attributed to the scattering of carriers and phonons by layer interface and grain boundary, respectively. The sample with the smallest modulation period (160 nm) possessed the highest power factor of ∼0.74 at room temperature and ∼1.56 mW m−1 K−2 at 405 °C. The insertion of heterogeneous layer into films is an effective method to increase Seebeck coefficient and decrease thermal conductivity, thus increasing thermoelectric figure of merit of films.
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来源期刊
Current Applied Physics
Current Applied Physics 物理-材料科学:综合
CiteScore
4.80
自引率
0.00%
发文量
213
审稿时长
33 days
期刊介绍: Current Applied Physics (Curr. Appl. Phys.) is a monthly published international journal covering all the fields of applied science investigating the physics of the advanced materials for future applications. Other areas covered: Experimental and theoretical aspects of advanced materials and devices dealing with synthesis or structural chemistry, physical and electronic properties, photonics, engineering applications, and uniquely pertinent measurement or analytical techniques. Current Applied Physics, published since 2001, covers physics, chemistry and materials science, including bio-materials, with their engineering aspects. It is a truly interdisciplinary journal opening a forum for scientists of all related fields, a unique point of the journal discriminating it from other worldwide and/or Pacific Rim applied physics journals. Regular research papers, letters and review articles with contents meeting the scope of the journal will be considered for publication after peer review. The Journal is owned by the Korean Physical Society.
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