利用简单的斜角沉积技术开发基于螯合态二氧化钛薄膜的高灵敏度紫外线光电探测器

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Pinky Khundrakpam, Biraj Shougaijam, Ashish Ranjan
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引用次数: 0

摘要

利用电子束蒸发室中的斜角沉积(OAD)技术,在 p 型硅(Si)衬底上制作了基于 Chevronic TiO2 薄膜(CTF)的紫外线(UV)光电探测器。为了比较紫外线光电探测器的性能,还制作了传统的二氧化钛薄膜(TTF)。场发射扫描电子显微镜(FE-SEM)图像验证了成功制备的螯合 TiO2 纳米结构(约 236 nm)的多孔性,而 X 射线衍射(XRD)分析则证实了 CTTF 和 TTF 样品的非晶体性质。与传统的 TTF 相比,CTF 在 ~ 380 nm 和 800 nm 波长之间的光吸收强度有所提高。从 CTTF 的陶克曲线图中观察到其能带隙为 3.31 eV。与传统的 TTF 和之前报道的其他光电探测器相比,基于 CTTF 和 TTF 的光电探测器在光灵敏度(~ 7.65)、响应度(~ 1.79 A/W)、检测度(~ 1.40 × 1012 Jonnes)、噪声等效功率(~ 2.01 × 10-12)和外部量子效率(5.69)等方面都有优异的表现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Development of highly sensitive UV photodetector based on chevronic TiO2 thin film using simple oblique angle deposition technique

Development of highly sensitive UV photodetector based on chevronic TiO2 thin film using simple oblique angle deposition technique

Chevronic TiO2 thin film (CTTF)-based ultraviolet (UV) photodetector was fabricated on p-type silicon (Si) substrate using oblique angle deposition (OAD) technique inside an electron beam evaporation chamber. A conventional TiO2 thin film (TTF) was also fabricated to compare the performances of the UV photodetectors. The field emission scanning electron microscopy (FE-SEM) image verified the porous nature of the successfully fabricated chevronic TiO2 nanostructures (~ 236 nm), while the X-ray diffraction (XRD) analysis confirmed the amorphous nature of both the CTTF and TTF samples. Optical absorption of CTTF showed enhancement of absorption intensity between ~ 380 nm and 800 nm wavelength than the conventional TTF. An energy bandgap of ~ 3.31 eV was observed from the Tauc plot of the CTTF. The CTTF- and TTF-based photodetector devices were analyzed under UV illumination (~ 390 nm) at a biasing of − 2 V. Superior performances of the CTTF-based photodetector in terms of photosensitivity (~ 7.65), responsivity (~ 1.79 A/W), detectivity (~ 1.40 × 1012 Jonnes), noise equivalent power (~ 2.01 × 10–12) and external quantum efficiency (5.69) were achieved compared to the conventional TTF and other previously reported photodetectors.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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