热拉伸半导体光纤:制造策略与应用

IF 14 Q1 CHEMISTRY, MULTIDISCIPLINARY
Zhixun Wang,  and , Lei Wei*, 
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引用次数: 0

摘要

可穿戴电子设备使电子产品无缝融入我们的日常生活。近年来,智能戒指、手环和手表等消费级可穿戴设备因其能够为日常活动提供稳定可靠的数据收集和帮助而大受欢迎。此外,可穿戴电子设备正在专业医疗服务领域崭露头角,如连续血糖监测和微创血栓切除术,以帮助医护人员进行诊断和治疗。此外,物联网(IoT)的普及进一步推动了对可穿戴电子设备的需求,因为它们是物联网系统的关键组件,可支持跨多个设备和平台共享和分析数据。可以预见,未来可穿戴电子设备市场将继续扩大。半导体是可穿戴电子设备的关键组件,尤其是在纤维形式中,半导体可实现单片纤维电子设备和智能纺织品。目前已开发出几种制造无机半导体纤维的技术,如 Czochralski 生长法、微拉伸工艺和热拉伸技术。半导体纤维的热拉伸技术是一种将半导体材料由玻璃状包层材料支撑并加热成流体熔体,然后将其组合拉伸到纤维尺寸的技术。在各种制造方法中,热拉伸技术具有成品率高、可集成多种材料、可实现可设计的复杂结构以及延长单股光纤长度等优点。拉制后的半导体纤维可直接用作可穿戴电子设备的构件,或在使用前通过后处理程序按需改变尺寸、几何形状或相结构。对流体动力学、流变学和分子结构演化的基本理解方面的研究工作旨在提高热拉伸半导体纤维的性能和质量,如导电性、带隙、电子迁移率、热稳定性和机械强度。在本报告中,我们将系统地回顾我们在开发半导体纤维及其在可穿戴电子设备(包括二极管、传感器、能量收集器等)中的应用方面所做的努力。我们首先介绍了三种主要的热拉伸方法,并突出了每种方法的独特之处。接下来,我们将讨论进一步改变半导体纤维材料、结构和几何形状的后处理方法。然后,我们讨论了各种设备和应用,最后探讨了当前面临的挑战以及我们对未来研究方向的展望。本开户绑定手机领体验金旨在激励进一步的研究工作,以扩大纤维材料、纤维内部结构设计和器件组装配置的范围,从而实现半导体纤维在各个领域的广泛应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Thermally Drawn Semiconductor Fibers: Fabrication Strategies and Applications

Thermally Drawn Semiconductor Fibers: Fabrication Strategies and Applications

Wearable electronics enable seamless incorporation of electronics into our daily lives. Consumer-grade wearables, such as smart rings, bands, and watches, have gained popularity in recent years due to their capacity to offer consistent and dependable data collection and assistance for daily activities. Moreover, wearable electronics are emerging in professional medical services, such as continuous glucose monitoring and minimally invasive thrombectomy, to aid healthcare professionals in diagnosing and treating. In addition, the proliferation of the Internet of Things (IoT) has further fueled the demand for wearable electronics, as they are the critical components for an IoT system to support the sharing and analysis of data across multiple devices and platforms. The market for wearable electronics predictably continues to expand in the future. Semiconductors are crucial components of wearable electronics, and especially in fiber form factor, they enable monolithic fiber electronics and smart textiles. Several techniques are developed for fabricating inorganic semiconductor fibers, such as the Czochralski growth method, micropulling-down process, and thermal drawing technique. Thermal drawing of semiconductor fibers is a technique in which semiconductor materials are supported by glassy cladding materials and heated into fluid melts, with the combination drawn to fiber dimensions. Among the various fabrication methods, the thermal drawing technique has the advantages of a high yield rate, feasible integration of multiple materials, the capability of achieving designable sophisticated structures, and an extended single-strand fiber length. The as-drawn semiconductor fibers may serve as the building blocks of wearable electronics directly or subject to postprocessing procedures for on-demand alteration of dimension, geometry, or phase structure before employment. Research efforts within the fundamental understanding of fluid dynamics, rheology, and molecular structure evolution seek to improve the performance and quality of thermally drawn semiconductor fibers such as conductivity, bandgap, electron mobility, thermal stability, and mechanical strength. In this Account, we systematically recapitulate our efforts in developing semiconductor fibers and their application in wearable electronics, including diodes, sensors, energy harvesters, and more. We begin by introducing the three primary thermal drawing methods, highlighting the unique features of each. Next, postprocessing methods to further alter the materials, structures, and geometries of semiconductor fibers are discussed. We then discuss the various devices and applications and conclude with an examination of current challenges and our perspectives on future research directions. This Account aims to inspire further research efforts to expand the scope of fiber materials, the design of in-fiber structures, and configurations of device assembly to achieve widespread adoption of semiconductor fibers in various fields.

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