Yusong Ding, Fangming Lian, Yi Tao, Hao Cheng, Yun Dong
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Disclosing the Contribution of Vacancy Defects to Thermal Transport at liquid-Al/Graphene Adhesion Interface
The adhesion properties of liquid-solid interfaces are of fundamental importance in performance and design of nanodevices. Modulating interfacial thermal transport has the potential to enhance interfacial heat dissipation in nanodevices. Here, the adhesive characteristics of the liquid-solid interface formed by liquid-Al/graphene are reported using molecular dynamics, and the intrinsic mechanism of interfacial adhesion evolution and energy heat transport is revealed. Specifically, an increase in temperature significantly reduces the adhesion and thermal transport capacity. Concurrently, the expansion of vacancy defects strengthens the interfacial adhesion property. This is due to the fact that the enlarged vacancy defects enhance the local contact and interfacial thermal conductance (ITC) between the atoms, thereby optimizing interfacial energy transport. The augmented ITC facilitates interfacial energy heat exchange and phonon participation rate (PPR), thus increases interfacial phonon modes and further reinforces the adhesion force. This paper elucidates the evolution of interfacial adhesion characteristics of liquid-Al/graphene, providing substantial guidance for a more comprehensive understanding of energy transport at the liquid-solid interface.
期刊介绍:
Nanoscale is a high-impact international journal, publishing high-quality research across nanoscience and nanotechnology. Nanoscale publishes a full mix of research articles on experimental and theoretical work, including reviews, communications, and full papers.Highly interdisciplinary, this journal appeals to scientists, researchers and professionals interested in nanoscience and nanotechnology, quantum materials and quantum technology, including the areas of physics, chemistry, biology, medicine, materials, energy/environment, information technology, detection science, healthcare and drug discovery, and electronics.