含有巯基超支化聚硅氧烷的环氧树脂,具有理想的机械性能和较低的固化温度

IF 4.1 2区 化学 Q2 POLYMER SCIENCE
Feifei Wang, Junyan Yao, Kaiming Yang, Bingrui Shi, Zhenlong Zhang, Weixu Feng, Hongxia Yan
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引用次数: 0

摘要

高性能环氧材料通常需要高温固化,这可能导致缺陷、脆性、变形和加工困难。本文采用 "一锅法 "制备了改性剂巯基超支化聚硅氧烷(HSiSH)。并研究了 HSiSH 对环氧树脂固化温度、力学性能和热性能的影响。结果表明,添加 2.0 wt% HSiSH 的环氧树脂具有优异的综合性能,其中弯曲强度为 159.37 MPa,冲击强度为 24.77 kJ/m2,拉伸剪切强度为 14.02 MPa,同时热性能也得到了改善。此外,2 wt% HSiSH 的存在可促进固化过程,使表观活化能降低 12.25%。高度支化的拓扑结构、链缠结、"刚柔并济 "的 -Si-O-C- 段和活性基团提高了材料的强度和韧性。同时,HSiSH 中的大量活性基团积极参与固化反应,从而增强了树脂与基材表面之间的粘合力,提高了粘合剂的粘合性能。这项研究为开发在较低和中等温度下固化的高性能环氧树脂奠定了坚实的理论基础。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Epoxy resins containing sulfhydryl hyperbranched polysiloxane with desirable mechanical properties and lower curing temperature

Epoxy resins containing sulfhydryl hyperbranched polysiloxane with desirable mechanical properties and lower curing temperature

Epoxy resins containing sulfhydryl hyperbranched polysiloxane with desirable mechanical properties and lower curing temperature
High-performance epoxy materials often necessitate curing at high-temperature, which can lead to defects, brittleness, deformation and processing difficulties. In this paper, the modifier sulfhydryl hyperbranched polysiloxane (HSiSH) was fabricated by the “one-pot” method. And investigated the effect of HSiSH on the curing temperature, mechanical and thermal properties of epoxy resin. The epoxy with the addition of 2.0 wt% HSiSH showcased superior comprehensive properties, including flexural strength of 159.37 MPa, impact strength of 24.77 kJ/m2, and tensile shear strength of 14.02 MPa, as well as the thermal properties are improved. Moreover, the presence of 2.0 wt% HSiSH can facilitate the curing process reducing the apparent activation energy by 12.25 %. The highly branched topology, chain entanglement, "rigid-flexible" -Si-O-C- segment and active groups improve the strength and toughness of the material. Simultaneously, the numerous reactive groups within HSiSH actively participate in the curing reaction, thereby enhancing the adhesion between the resin and the substrate surface which increasing the bonding performance of the adhesive. This study lays a solid theoretical foundation for developing high-performance epoxy resins cured at lower and moderate temperatures.
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来源期刊
Polymer
Polymer 化学-高分子科学
CiteScore
7.90
自引率
8.70%
发文量
959
审稿时长
32 days
期刊介绍: Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics. The main scope is covered but not limited to the following core areas: Polymer Materials Nanocomposites and hybrid nanomaterials Polymer blends, films, fibres, networks and porous materials Physical Characterization Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films Polymer Engineering Advanced multiscale processing methods Polymer Synthesis, Modification and Self-assembly Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization Technological Applications Polymers for energy generation and storage Polymer membranes for separation technology Polymers for opto- and microelectronics.
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