激光冲击强化对不同烧结添加剂比例氮化硅陶瓷的影响

IF 5.1 2区材料科学 Q1 MATERIALS SCIENCE, CERAMICS

Ceramics International Pub Date : 2024-09-24 DOI:10.1016/j.ceramint.2024.09.298

Seongguk Bae , Haneul Kim , Jaepil Lee , Sungho Jeong

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引用次数: 0

摘要

用于工业应用的氮化硅陶瓷（Si3N4）在生产过程中通常会添加烧结添加剂，这些添加剂的含量不同，Si3N4 的性能也会发生显著变化。在本研究中，我们研究了激光冲击喷丸（LSP）对使用不同比例烧结添加剂烧结的 Si3N4 的影响。Si3N4 样品使用 Y2O3、MgO 和 SiO2 混合烧结添加剂烧结，烧结添加剂的重量分别为 5、7、9 和 11%。使用 Nd:YAG 激光器（波长 = 532 nm，最大脉冲能量 = 1.4 J，重复频率 = 10 Hz，脉冲持续时间 = 8 ns，光束直径 = 11 mm，顶帽轮廓）照射 Si3N4 样品。样品上涂有保护层（100 μm 厚的铝箔）和水层，以限制等离子体。使用 5% 烧结添加剂的 Si3N4 低辐照度辐照使表面硬度略有变化，但表面压缩残余应力减少了 77%。与此相反，使用 11% 烧结添加剂的 Si3N4 低温等离子体沉积法同时提高了表面硬度（7.3%）和表面压缩残余应力（67%），这表明低温等离子体沉积法的效果因烧结添加剂的比例不同而存在显著差异。此外，含有 11% 烧结添加剂的 Si3N4 表面在 LSP 之后显示出晶粒细化的迹象。研究表明，含有 11% 烧结添加剂的 Si3N4 的抗弯强度提高了 15.2%，断裂源深度明显加深。

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Effects of laser shock peening on silicon nitride ceramic with varying sintering additive ratios

Silicon nitride ceramic (Si₃N₄) for industrial applications is conventionally manufactured with sintering additives, and the properties of Si₃N₄ change significantly based on the contents of these additives. In this study, we investigate the effects of laser shock peening (LSP) on Si₃N₄ sintered with varying ratios of sintering additives.

The Si₃N₄ samples were sintered with a mixture of Y₂O₃, MgO, and SiO₂ sintering additives at 5, 7, 9, and 11 wt%. A Nd:YAG laser (wavelength = 532 nm, maximum pulse energy = 1.4 J, repetition rate = 10 Hz, pulse duration = 8 ns, beam diameter = 11 mm, top-hat profile) was used to irradiate the Si₃N₄ samples. The samples were coated with a protective layer (100 μm thick aluminum foil) and a water layer to confine plasma. LSP of Si₃N₄ with 5 % sintering additives resulted in a slight change in surface hardness but a 77 % decrease in surface compressive residual stress. In contrast, LSP of Si₃N₄ with 11 % sintering additives led to a simultaneous increase in surface hardness (7.3 %) and surface compressive residual stress (67 %), indicating a significant difference in the effectiveness of LSP depending on the ratio of sintering additives. Additionally, the surface of Si₃N₄ with 11 % sintering additives showed evidence of grain refinement after LSP. It was demonstrated that the bending strength of Si₃N₄ with 11 % sintering additives increased by 15.2 %, and the depth of the fracture origin was significantly deepened.

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来源期刊

Ceramics International 工程技术-材料科学：硅酸盐

CiteScore

9.40

自引率

15.40%

发文量

4558

审稿时长

25 days

期刊介绍： Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties. Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour. Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.