Zhaoqi Hou , Tao Wang , Peipei Wang , Yuhao Wu , Wanchang Sun
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引用次数: 0
摘要
利用磁控溅射技术制备了不同厚度(从 600 纳米到 2200 纳米)的纳米金属钛和锆单层薄膜。显微结构结果表明,Ti 薄膜在 t ≤ 600 nm 时由 hcp 转变为 fcc,而 Zr 薄膜则生长为纳米柱状晶粒的 hcp 结构。此外,hcp Ti 薄膜的晶粒取向从 t = 1200 nm 时的(0002)优先取向转变为厚度较大时的无规取向。随后,通过纳米压痕法探究了薄膜的硬度和应变速率敏感性。霍尔-佩奇关系显然无法解释钛和锆薄膜随厚度变化的硬化行为,因此讨论了相结构、取向和残余应力对纳米压痕硬度的影响。看来残余应力在目前钛和锆薄膜硬度的决定中起着重要作用。在 fcc Ti 薄膜的塑性变形过程中出现了负应变速率灵敏度 m,这是由相变引起的。此外,还讨论了 hcp Ti 和 Zr 薄膜的基本变形机制。
Size dependent mechanical properties and deformation mechanisms in Ti and Zr films
The nanometallic Ti and Zr monolayer films with various thicknesses ranging from 600 to 2200 nm were prepared by using magnetron sputtering technique. The microstructure results demonstrated that Ti films transformed from hcp to fcc at t ≤ 600 nm, while Zr films were grown with hcp structure of nanocolumnar grain. Moreover, the grain orientation of hcp Ti films changed from (0002) preferred orientation at t = 1200 nm to random orientation at larger thickness. Subsequently, the hardness and strain rate sensitivity of films were explored by nanoindentation. The Hall-Petch relationship is obviously invalid to explain the film thickness dependent hardening behaviors in Ti and Zr films, and the influence of phase structure, orientation and residual stress on nanoindentation hardness was discussed. It seems that residual stress plays an important role in the determination of hardness in present Ti and Zr films. The negative strain rate sensitivity m appeared during the plastic deformation of fcc Ti films, which is caused by the phase transformation. The underlying deformation mechanism of hcp Ti and Zr films was also discussed.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.