Yuwen You , Yan Chen , Bin Yang , Chunmei Guo , Rong Gao , Yiwei Ma
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Optimization of liquid film parameters of indirect evaporative cooling system based on machine vision
The wet channel plate surface of indirect evaporative cooler (IEC) cannot be completely wet in actual working conditions, and the plate surface parameters of liquid film wetting rate and liquid film thickness are difficult to observe, and the lack of relevant experimental research and data support. Therefore, in this paper, machine vision technology will be used to experimentally investigate the wetting rate and liquid film thickness of the secondary side channel of the IEC, and the UDF interface program and the parameters of the original simulation model will be enhanced. The results show that the average and maximum errors of the first and second outlet temperatures of the corrected analytical model are reduced compared with the original model, and the average error is within 5% under different spray flow rates.
期刊介绍:
Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.