Adeel Arshad , Muhammad Ikhlaq , Muhammad Saeed , Muhammad Imran
{"title":"用于电子设备冷却的单一和混合纳米流体冷却微翅片散热器的数值分析(第二部分)","authors":"Adeel Arshad , Muhammad Ikhlaq , Muhammad Saeed , Muhammad Imran","doi":"10.1016/j.tsep.2024.103005","DOIUrl":null,"url":null,"abstract":"<div><div>This study investigates the thermal and hydraulic performance of heat sinks with micro pin-fins in circular and rectangular configurations using mono and hybrid nanofluids. Motivated by the need for efficient cooling solutions in high-performance electronic devices, the research explores novel combinations of metallic oxide (Ag, MgO) and carbon-based nanoparticles (GNP, MWCNT) in nanofluids. A constant volume fraction of micro pin-fins and nanoparticles was maintained to assess their effects on thermohydraulic performance. The method involved experiments with aqueous nanofluids as coolants, measuring pressure drops (<span><math><mrow><mi>Δ</mi><mi>p</mi></mrow></math></span>) at the inlet and outlet. Thermal performance was evaluated using metrics like thermal resistance (<span><math><msub><mi>R</mi><mrow><mi>th</mi></mrow></msub></math></span>), Nusselt number (<span><math><mrow><mi>N</mi><msub><mi>u</mi><mrow><mi>avg</mi></mrow></msub></mrow></math></span>), pumping power (<span><math><mrow><mi>PP</mi></mrow></math></span>), volumetric flow rate (<span><math><mi>Q</mi></math></span>), overall performance (<span><math><mrow><mi>OP</mi></mrow></math></span>), and performance evaluation criterion (<span><math><mrow><mi>PEC</mi></mrow></math></span>). Results showed that GNP-based mono nanofluids significantly reduced <span><math><msub><mi>R</mi><mrow><mi>th</mi></mrow></msub></math></span> by 46.41% and increased <span><math><mrow><mi>N</mi><msub><mi>u</mi><mrow><mi>avg</mi></mrow></msub></mrow></math></span> by 60.54% and PEC by 62% in rectangular heat sinks compared to conventional water cooling. Comparisons between rectangular and circular configurations revealed minimal <span><math><msub><mi>R</mi><mrow><mi>th</mi></mrow></msub></math></span> differences of 2.54% and 3.57%. GNP-dispersed nanofluids outperformed other coolants, with the rectangular configuration achieving a higher <span><math><mrow><mi>PEC</mi></mrow></math></span> of 1.62 versus 1.52 for the circular configuration at Δ<em>p</em> = 820 Pa. The conclusions suggest that rectangular pin-fins with GNP-based nanofluids offer superior thermohydraulic performance. The key outcomes from current study have significant contribution in enhancing the cooling efficiency of advanced electronic systems.</div></div>","PeriodicalId":23062,"journal":{"name":"Thermal Science and Engineering Progress","volume":"55 ","pages":"Article 103005"},"PeriodicalIF":5.1000,"publicationDate":"2024-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Numerical analysis of mono and hybrid nanofluids-cooled micro finned heat sink for electronics cooling-(Part-II)\",\"authors\":\"Adeel Arshad , Muhammad Ikhlaq , Muhammad Saeed , Muhammad Imran\",\"doi\":\"10.1016/j.tsep.2024.103005\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This study investigates the thermal and hydraulic performance of heat sinks with micro pin-fins in circular and rectangular configurations using mono and hybrid nanofluids. Motivated by the need for efficient cooling solutions in high-performance electronic devices, the research explores novel combinations of metallic oxide (Ag, MgO) and carbon-based nanoparticles (GNP, MWCNT) in nanofluids. A constant volume fraction of micro pin-fins and nanoparticles was maintained to assess their effects on thermohydraulic performance. The method involved experiments with aqueous nanofluids as coolants, measuring pressure drops (<span><math><mrow><mi>Δ</mi><mi>p</mi></mrow></math></span>) at the inlet and outlet. Thermal performance was evaluated using metrics like thermal resistance (<span><math><msub><mi>R</mi><mrow><mi>th</mi></mrow></msub></math></span>), Nusselt number (<span><math><mrow><mi>N</mi><msub><mi>u</mi><mrow><mi>avg</mi></mrow></msub></mrow></math></span>), pumping power (<span><math><mrow><mi>PP</mi></mrow></math></span>), volumetric flow rate (<span><math><mi>Q</mi></math></span>), overall performance (<span><math><mrow><mi>OP</mi></mrow></math></span>), and performance evaluation criterion (<span><math><mrow><mi>PEC</mi></mrow></math></span>). Results showed that GNP-based mono nanofluids significantly reduced <span><math><msub><mi>R</mi><mrow><mi>th</mi></mrow></msub></math></span> by 46.41% and increased <span><math><mrow><mi>N</mi><msub><mi>u</mi><mrow><mi>avg</mi></mrow></msub></mrow></math></span> by 60.54% and PEC by 62% in rectangular heat sinks compared to conventional water cooling. Comparisons between rectangular and circular configurations revealed minimal <span><math><msub><mi>R</mi><mrow><mi>th</mi></mrow></msub></math></span> differences of 2.54% and 3.57%. GNP-dispersed nanofluids outperformed other coolants, with the rectangular configuration achieving a higher <span><math><mrow><mi>PEC</mi></mrow></math></span> of 1.62 versus 1.52 for the circular configuration at Δ<em>p</em> = 820 Pa. The conclusions suggest that rectangular pin-fins with GNP-based nanofluids offer superior thermohydraulic performance. The key outcomes from current study have significant contribution in enhancing the cooling efficiency of advanced electronic systems.</div></div>\",\"PeriodicalId\":23062,\"journal\":{\"name\":\"Thermal Science and Engineering Progress\",\"volume\":\"55 \",\"pages\":\"Article 103005\"},\"PeriodicalIF\":5.1000,\"publicationDate\":\"2024-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Thermal Science and Engineering Progress\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2451904924006231\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENERGY & FUELS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thermal Science and Engineering Progress","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2451904924006231","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENERGY & FUELS","Score":null,"Total":0}
Numerical analysis of mono and hybrid nanofluids-cooled micro finned heat sink for electronics cooling-(Part-II)
This study investigates the thermal and hydraulic performance of heat sinks with micro pin-fins in circular and rectangular configurations using mono and hybrid nanofluids. Motivated by the need for efficient cooling solutions in high-performance electronic devices, the research explores novel combinations of metallic oxide (Ag, MgO) and carbon-based nanoparticles (GNP, MWCNT) in nanofluids. A constant volume fraction of micro pin-fins and nanoparticles was maintained to assess their effects on thermohydraulic performance. The method involved experiments with aqueous nanofluids as coolants, measuring pressure drops () at the inlet and outlet. Thermal performance was evaluated using metrics like thermal resistance (), Nusselt number (), pumping power (), volumetric flow rate (), overall performance (), and performance evaluation criterion (). Results showed that GNP-based mono nanofluids significantly reduced by 46.41% and increased by 60.54% and PEC by 62% in rectangular heat sinks compared to conventional water cooling. Comparisons between rectangular and circular configurations revealed minimal differences of 2.54% and 3.57%. GNP-dispersed nanofluids outperformed other coolants, with the rectangular configuration achieving a higher of 1.62 versus 1.52 for the circular configuration at Δp = 820 Pa. The conclusions suggest that rectangular pin-fins with GNP-based nanofluids offer superior thermohydraulic performance. The key outcomes from current study have significant contribution in enhancing the cooling efficiency of advanced electronic systems.
期刊介绍:
Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.