Longjie Li , Qianfan Tang , Xuejin Chen , Can Weng
{"title":"基于聚合物的针翅微通道热交换器:材料和结构对性能影响的比较研究","authors":"Longjie Li , Qianfan Tang , Xuejin Chen , Can Weng","doi":"10.1016/j.ijthermalsci.2024.109546","DOIUrl":null,"url":null,"abstract":"<div><div>In this comprehensive study, the applicability and heat transfer dynamics of polymer pin-fin microchannel heat exchangers were investigated through a combination of experimental and numerical approaches. The findings revealed that enhancements in material thermal conductivity do not exhibit a linear correlation with improvements in heat transfer performance. Beyond a certain threshold, the impact of thermal conductivity on temperature stability diminishes significantly. Notably, polymer-based micro heat exchangers demonstrated remarkable temperature uniformity in comparison to other materials. To address the issue of localized thermal peaks in electronic chipsets, a heat exchanger featuring variable pin-fin sizes was designed. This design resulted in a significant reduction in the temperature of the heat source when compared to a constant-size pin-fin configuration. Specifically, variable-size pin-fin structures (the staggered-arrangement variable-size micro-needle-fin heat exchanger (<em>VSPFS</em>) and the inline-arrangement variable-size micro-needle-fin heat exchanger (<em>VIPFS</em>)) achieved temperature reductions in the range of 1.41–3.60<em>K</em> and 6.07–8.48<em>K</em>, respectively, when compared to their isometric counterparts (the staggered-arrangement constant-size micro-needle-fin heat exchanger (<em>ISPFS</em>) and the inline array of constant-size pin-fin microchannel heat exchanger (IIPFS)). Furthermore, these structures significantly decreased the average temperature difference across the heat source, effectively mitigating thermal hotspots by up to 3.23<em>K</em> and 5.73<em>K</em>, respectively. Among the tested configurations, <em>VSPFS</em> exhibited the highest Performance Evaluation Criterion (<em>PEC</em>) value and the smallest increase in entropy generation, highlighting its superior overall thermal management capability. Additionally, as the Reynolds number increased, convective heat transfer entropy generation decreased while fluid friction entropy generation increased, indicating that energy losses due to fluid friction gradually outweighed the benefits of enhanced heat transfer at higher Reynolds numbers.</div></div>","PeriodicalId":341,"journal":{"name":"International Journal of Thermal Sciences","volume":"209 ","pages":"Article 109546"},"PeriodicalIF":4.9000,"publicationDate":"2024-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Polymer-based pin-fin microchannel heat exchangers: A comparative study of material and structural effects on performance\",\"authors\":\"Longjie Li , Qianfan Tang , Xuejin Chen , Can Weng\",\"doi\":\"10.1016/j.ijthermalsci.2024.109546\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>In this comprehensive study, the applicability and heat transfer dynamics of polymer pin-fin microchannel heat exchangers were investigated through a combination of experimental and numerical approaches. The findings revealed that enhancements in material thermal conductivity do not exhibit a linear correlation with improvements in heat transfer performance. Beyond a certain threshold, the impact of thermal conductivity on temperature stability diminishes significantly. Notably, polymer-based micro heat exchangers demonstrated remarkable temperature uniformity in comparison to other materials. To address the issue of localized thermal peaks in electronic chipsets, a heat exchanger featuring variable pin-fin sizes was designed. This design resulted in a significant reduction in the temperature of the heat source when compared to a constant-size pin-fin configuration. Specifically, variable-size pin-fin structures (the staggered-arrangement variable-size micro-needle-fin heat exchanger (<em>VSPFS</em>) and the inline-arrangement variable-size micro-needle-fin heat exchanger (<em>VIPFS</em>)) achieved temperature reductions in the range of 1.41–3.60<em>K</em> and 6.07–8.48<em>K</em>, respectively, when compared to their isometric counterparts (the staggered-arrangement constant-size micro-needle-fin heat exchanger (<em>ISPFS</em>) and the inline array of constant-size pin-fin microchannel heat exchanger (IIPFS)). Furthermore, these structures significantly decreased the average temperature difference across the heat source, effectively mitigating thermal hotspots by up to 3.23<em>K</em> and 5.73<em>K</em>, respectively. Among the tested configurations, <em>VSPFS</em> exhibited the highest Performance Evaluation Criterion (<em>PEC</em>) value and the smallest increase in entropy generation, highlighting its superior overall thermal management capability. Additionally, as the Reynolds number increased, convective heat transfer entropy generation decreased while fluid friction entropy generation increased, indicating that energy losses due to fluid friction gradually outweighed the benefits of enhanced heat transfer at higher Reynolds numbers.</div></div>\",\"PeriodicalId\":341,\"journal\":{\"name\":\"International Journal of Thermal Sciences\",\"volume\":\"209 \",\"pages\":\"Article 109546\"},\"PeriodicalIF\":4.9000,\"publicationDate\":\"2024-11-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Thermal Sciences\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1290072924006689\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Thermal Sciences","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1290072924006689","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Polymer-based pin-fin microchannel heat exchangers: A comparative study of material and structural effects on performance
In this comprehensive study, the applicability and heat transfer dynamics of polymer pin-fin microchannel heat exchangers were investigated through a combination of experimental and numerical approaches. The findings revealed that enhancements in material thermal conductivity do not exhibit a linear correlation with improvements in heat transfer performance. Beyond a certain threshold, the impact of thermal conductivity on temperature stability diminishes significantly. Notably, polymer-based micro heat exchangers demonstrated remarkable temperature uniformity in comparison to other materials. To address the issue of localized thermal peaks in electronic chipsets, a heat exchanger featuring variable pin-fin sizes was designed. This design resulted in a significant reduction in the temperature of the heat source when compared to a constant-size pin-fin configuration. Specifically, variable-size pin-fin structures (the staggered-arrangement variable-size micro-needle-fin heat exchanger (VSPFS) and the inline-arrangement variable-size micro-needle-fin heat exchanger (VIPFS)) achieved temperature reductions in the range of 1.41–3.60K and 6.07–8.48K, respectively, when compared to their isometric counterparts (the staggered-arrangement constant-size micro-needle-fin heat exchanger (ISPFS) and the inline array of constant-size pin-fin microchannel heat exchanger (IIPFS)). Furthermore, these structures significantly decreased the average temperature difference across the heat source, effectively mitigating thermal hotspots by up to 3.23K and 5.73K, respectively. Among the tested configurations, VSPFS exhibited the highest Performance Evaluation Criterion (PEC) value and the smallest increase in entropy generation, highlighting its superior overall thermal management capability. Additionally, as the Reynolds number increased, convective heat transfer entropy generation decreased while fluid friction entropy generation increased, indicating that energy losses due to fluid friction gradually outweighed the benefits of enhanced heat transfer at higher Reynolds numbers.
期刊介绍:
The International Journal of Thermal Sciences is a journal devoted to the publication of fundamental studies on the physics of transfer processes in general, with an emphasis on thermal aspects and also applied research on various processes, energy systems and the environment. Articles are published in English and French, and are subject to peer review.
The fundamental subjects considered within the scope of the journal are:
* Heat and relevant mass transfer at all scales (nano, micro and macro) and in all types of material (heterogeneous, composites, biological,...) and fluid flow
* Forced, natural or mixed convection in reactive or non-reactive media
* Single or multi–phase fluid flow with or without phase change
* Near–and far–field radiative heat transfer
* Combined modes of heat transfer in complex systems (for example, plasmas, biological, geological,...)
* Multiscale modelling
The applied research topics include:
* Heat exchangers, heat pipes, cooling processes
* Transport phenomena taking place in industrial processes (chemical, food and agricultural, metallurgical, space and aeronautical, automobile industries)
* Nano–and micro–technology for energy, space, biosystems and devices
* Heat transport analysis in advanced systems
* Impact of energy–related processes on environment, and emerging energy systems
The study of thermophysical properties of materials and fluids, thermal measurement techniques, inverse methods, and the developments of experimental methods are within the scope of the International Journal of Thermal Sciences which also covers the modelling, and numerical methods applied to thermal transfer.