液态金属印刷半导体

IF 3.4 3区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Advanced Engineering Materials Pub Date : 2024-11-07 DOI:10.1002/adem.202470058

Yujia Song, Jingyi Li, Ju Wang, Bangdeng Du, Jing Liu

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引用次数: 0

摘要

液态金属打印半导体在编号为 2400029 的文章中，Bangdeng Du、Jing Liu 和合作者介绍了液态金属半导体制造的新兴战略；这些战略有望彻底改变电子工程，并显示出使用液态金属打印机制造半导体和功能器件的潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Liquid Metal-Printed Semiconductors

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Liquid Metal-Printed Semiconductors

Liquid Metal-Printed Semiconductors

In article number 2400029, Bangdeng Du, Jing Liu, and co-workers present emerging strategies for liquid-metal semiconductors manufacturing; these are expected to revolutionize electronic engineering and show potential for the use of liquid-metal printers to build semiconductors and functional devices as desired.

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来源期刊

Advanced Engineering Materials 工程技术-材料科学：综合

CiteScore

5.70

自引率

5.60%

发文量

544

审稿时长

1.7 months

期刊介绍： Advanced Engineering Materials is the membership journal of three leading European Materials Societies - German Materials Society/DGM, - French Materials Society/SF2M, - Swiss Materials Federation/SVMT.